Microsensors including MEMS devices and microsystem integration concepts have since entered the food industry market. Challenged by scandals like the meat scandal in germany, mad cow disease claims in the US and milk contaminations in China have made consumers more aware than ever to hazards contained in food. The network “Food Microsystems” has taken up that penny to show where microsystems can help identifying risks and ensure safe food consumption. Please see their website for more details!
If you are a member of the professional network LinkedIn, you may want to join the CPMT group.
See here for a brief view to the group’s activities
The TC is about to undergo a major change….
MEMS and Sensor packaging used to be a challenge for the industry, but in recent years, solutions have surfaced that make the challenge less challenging. The TC committee has therefore-as part of the restructuring of the TC organization- suggested to rename the TC 11 from “MEMS and Sensor Packaging” to “Emerging Technologies” to reflect the strive of this TC to be at the cutting edge of the packaging process evolution.
Aside from the established topics, also bio-inspired concepts, 3d generative integration merging electronics with the 3d printing technologies will be adressed.
This year’s 63th ECTC, held in the Cosmopolitan, Las Vegas, started already with a big success. 41 technical sessions highlight the most recent developments and findings in hily advanced packaging and integration technologies. The first day was filled with scientific results from both academia as well industy, spanning all continents.
If you are in the area, make sure to walk in and benefit from the assembly of experts.
you will have until October 15th to submit your abstract for participation during the 63rd ECTC conference, held in Las Vegas!
Please refer yourself to the abstract submission page to share your world class results with the experts in packaging and integration technologies at the global premier conference on these topics.
If you are insecure if your work fits into the scope, please check out the call for paper!
Hurry up to secure your place during the 4th ESTC conference on System Integration Technologies!
September 17th -20th are the days to be in Amsterdam, NL to get insight in the newest technology trends for micro system integration.
Please see the details on this cutting edge conference at the ESTC website for more details and registration!
The DTIP conference held in 16-18th of April, 2013, in Barcelona (Spain) invites you to submit your abstract!
Please see the details on this cutting edge conference at the DTIP website!
Call for Papers and Professional Development Course Proposals
The premier international packaging, components and microelectronic systems technology conference invites you to submit your abstract!
The Electronic Components and Technology Conference (ECTC) invites you to submit an abstract and/or Professional Development Course (PDC) proposal for its 63rd conference in Las Vegas, Nevada. ECTC addresses new developments, trends, and applications for 3D integration, TSV, WLP, flip chip, materials, and other integrated systems packaging topics. All abstracts and proposals must be submitted electronically at www.ectc.net by October 8, 2012.
The MicroSys 2012 is held this year in Berlin, Germany.
To join from March 19th until March 21st, please register at their website where you can also find addtional information on the congress and exhibition.
the european industry platform EPoSS (European Technology Platform on Smart Sytems Integration) will organize as a part of the SSI2012 conference the ”MEMS Executive Congress Europe” on the 20th of March in Zürich, Switzerland.
Also, the day before, Workgroup Meetings are planned – to join these, please check out the EPoSS website.