The Organizing Committee of the 2013 IEEE CEIDP (Conference on Electrical Insulation and Dielectric Phenomena) is pleased to inform you that the abstract submission site is now open.
The abstract submission deadline is February 15, 2013. http://www.ewh.ieee.org/soc/dei/ceidp/abstract_2013.htm
2013 IEEE CEIDP will be held in Shenzhen, P.R. China, on October 20-23, 2013.
Shenzhen is only a 30 min. ferry ride from the Hong Kong International Airport.
Please visit the conference web site at http://www.ewh.ieee.org/soc/dei/ceidp/ceidp2013.htm for more information.
The First Call for Papers can be downloaded at http://www.ewh.ieee.org/soc/dei/ceidp/CEIDP_2013_FIRST_CALL_FOR_PAPERS.pdf
Looking forward to seeing you all in Shenzhen, P.R. China.
2013 IEEE CEIDP Conference Chair