IEEE Electrical Insulation Conference Authors announcement: the date for submission of papers has been extended to March 12, 2014.
Please go to http://sites.ieee.org/eic for more information!
2014 Thomas W Dakin Distinguished Technical
Recipient: Prof. John Fothergill
City University London, UK
John will receive the Dakin Award at the 2014 EIC, Philadelphia, PA, June 8-11,
Dielectrics and High Voltage Research Laboratories
DEIS is collecting the names and weblinks of dielectrics and high voltage research laboratories, which will be posted on the DEIS website. If your laboratory should be included in this list, please provide the laboratory name, country, and weblink and e-mail it to frank.hegeler(at)nrl.navy.mil
DEIS joined a group of IEEE societies called Sister Societies, which includes the Industry Applications Society (IAS), Industrial Electronics Society (IES), Power Electronics Society (PELS), and the Power & Energy Society (PES). DEIS will work closely with IAS, IES, PELS, and PES on Membership, Chapters, Conferences, Publications, and Standards, and this relationship will provide additional benefits to the DEIS members.
CALL FOR PAPERS
Special Issue of the
IEEE Transactions on Dielectrics and Electrical Insulation
Electrets and Related Phenomena
We are pleased to announce that the June 2015 issue of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) will be a special issue on electrets and related phenomena. This issue is open to all authors. Presenters of papers at the IEEE 15th International Symposium on Electrets (ISE15) to be held during August 10-13, 2014 in Baltimore (USA) are especially encouraged to submit their work to this special issue. For more information on ISE15 please go to www.ise15.org.
Topics include, but are not limited to:
Authors are invited to submit their papers to the Guest Editors of the Special Issue no later than August 31, 2014, at the TDEI website (http://www.cloznet.com/ieeetdei). On the submission form there is a location for Special Issue paper submission where the name of the Guest Editor is to be chosen. Instructions for the preparation of manuscripts and a template are available at the website or directly from:
In accordance with IEEE policy, papers that have been published in any Conference proceedings cannot be republished. Therefore, authors of the 2014 IEEE ISE15 are strongly advised to significantly expand and enhance their conference papers version prior to submission to this Special Issue of the IEEE TDEI.
Further questions concerning this Special Issue could be directed to either one of the two Guest Editors or directly to the Editor-in-Chief of the IEEE Transaction on Dielectrics and Electrical Insulation Professor Reuben Hackam (email@example.com)
The Guest Editors for this special issue are:
Department of Electrical Engineering
and Materials Research Institute
N219 Millennium Science Complex
The Pennsylvania State University
University Park, PA 16802, USA
Michael (Seungju) Yu
Department of Bioengineering
University of Utah
4501 SMBB, 36 S. Wasatch Drive
Salt Lake City, UT 84112, USA
CALL FOR PAPERS
Special Issue on Liquid Dielectrics
A Special issue of the IEEE Transactions on Dielectrics and Electrical Insulation is being planned on liquids dielectric for publication in October 2015. Authors wishing to have their papers considered for publication in this issue should submit their manuscripts to the IEEE Transactions on Dielectrics and Electrical Insulation web portal (http://www.cloznet.com/ieeetdei).
On the submission form there is a location for Special Issue paper submission where the name of the Guest Editor is to be chosen. Instructions for the preparation of manuscripts and a template are available at the website or directly from:
For this special issue suggested topics within the field of liquid dielectrics include, but are not limited to:
- Mineral oils of improved characteristics, additives and synthetic dielectric liquids;
- molecular structure and dielectric loss in liquids;
- electrical breakdown of liquids;
- electrical streamers in liquids;
- partial discharge and pre-breakdown process in liquids;
- electrical properties of new insulating liquids;
- conduction mechanism in dielectric liquids;
- behavior of insulating liquids between dielectric barriers;
- solid-liquid insulating systems;
- space charge in liquids.
In accordance with IEEE policy, papers that have been published in any Conference proceedings cannot be republished. Therefore, authors of the 2014 IEEE ICDL are strongly advised to significantly expand and enhance their conference papers version prior to submission to this Special Issue of the IEEE TDEI.
The deadline for the submission of the manuscripts is 30 November 2014.
The Guest Editors for this issue are:
Prof. Massimo Pompili (University of Rome “Sapienza”, Electrical Engineering Dept., Via Eudossiana,18 – 00184 Roma, Italy ; Email : firstname.lastname@example.org ; fax: +39-06-4883235),
Further questions concerning this Special Issue could be directed to either one of the two Guest Editors or directly to the Editor-in-Chief of the IEEE Transaction on Dielectrics and Electrical Insulation Professor Reuben Hackam (email@example.com).
The DEIS is seeking applicants for the position of Editor-in-Chief (EiC) of the Transactions on Dielectrics and Electrical Insulation (TDEI). Potential applicants should be a member of the IEEE, and be willing and able to carry out the duties of the EiC (described below). Applicants will be expected to have relevant experience, exhibit enthusiasm for the post, be able to manage the website submission process and further develop the system. It is expected that once in post, the EiC will make improvements to assessment procedures and will seek methods whereby the TDEI can increase in prominence when compared to competing journals. In doing this the EiC will consider the format of the journal, its publication policies and assess progress using publication metrics.
If you are interested in this post, please send an email to Professor Paul Lewin, DEIS VP Admin (firstname.lastname@example.org) for more information. Applications will be reviewed by the TDEI Editor Search Committee, who will prepare a recommendation for consideration by the June meeting of the DEIS Administrative Committee (AdCom). The latest date for acceptance of a letter of interest is March 31st 2014.
Position Description of Editor-in-Chief (EiC) of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI)
Plans for the 32nd Electrical Insulation Conference to be held in Philadelphia, PA between the 8th and 11th of June 2014 (see sites.ieee.org/eic) are already at an advanced stage. As the world’s premiere applied electrical insulation conference, the extensive technical program is supported by an exhibition featuring suppliers of dielectric materials, test equipment, instrumentation and sensors as well as organizations offering testing or consultancy services.
EIC delegates are a combination of industrial engineers, consultants and academics all of whom have interests in electrical insulation and real-world problems. Demand for exhibit space is high; at previous meetings of the EIC, exhibitors that applied late for space were disappointed that they could not be accommodated. In summary, the Electrical Insulation Conference offers a unique opportunity in North America for suppliers and manufacturers to meet with the end-users of their products and services.
Details for Exhibitors
Free promotion of new products and services: The Info Session
There will be opportunities for three 15 minute Info Sessions each on Monday and Tuesday immediately after the technical sessions close. The Info Sessions will be in the same area as the technical sessions. The six Info Session opportunities will be assigned on a first-come first-served basis to exhibitors so reserve your booth early. The rooms will have a PowerPoint projector, screen and podium microphone. Any additional audiovisual equipment will be the responsibility of the sponsoring company.
Companies interested in providing additional support to the conference are offered the opportunity to subsidize one of the five coffee breaks that are scheduled (two on Monday, two on Tuesday, and one on Wednesday). The cost to subsidize a coffee break is $1000. Companies providing support will be prominently identified with signage and noted in the printed conference program.
A sponsorship opportunity is also available to support printing of the conference proceedings. The cost to subsidize the production of the proceedings is $5,000. The company providing support will have their logo printed on all forms of the proceedings (flash drive, CD and print copies).
Contacts for further information
For further information please contact Mark Winkeler at email@example.com or Stephen Tuckwell at firstname.lastname@example.org for contract details. Visit the conference website at “sites.ieee.org/eic” to find the Exhibitor Agreement form and send a copy to Mark Winkeler.
EIC Volunteer Profile
Ramtin Omranipour is a technical leader at GE Power Conversion Large Motors and Generator Technology. He holds a Master degree from University of Waterloo and has been an IEEE member since 2001. He has participated in various IEEE DIES conferences since 2001 and has been a chair for many technical sessions at IEEE EIC conferences. He is one of the co-technical chairs for EIC 2014.
He is a proud husband and father of two children and enjoys having quality time with his family. He also enjoys sport activities such as soccer, volleyball, and basketball.
2015 EIC Update
The conference dates and venue are as follows:
Sunday 7th June 2015 – Wednesday 10th June
Renaissance Seattle Hotel, 515 Madison Street, Seattle, Washington, 98104
Chairs of IEEE Working Groups or DEIS Technical Committees considering meetings or workshops before, during or immediately after the EIC 2015, should contact Paul Lewin (Conference Chair) at email@example.com in order to ensure that meeting rooms can be made available.
CALL FOR PAPERS
High Voltage Direct Current (HVDC) Insulation and Diagnostics
We are pleased to announce that the October 2014 issue of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) will be a special issue on High Voltage Direct Current (HVDC) Transmission System Insulation topics. The aim of this issue is to provide a state-of-the-art of all aspects related to design, manufacturing, operation and diagnosis of all HVDC components (transformers, valves, insulators, cables, GIS). This issue is open to all authors. Topics include, but are not restricted to:
New materials for HVDC insulation systems
Authors are invited to submit their papers to the Guest Editors of the Special Issue no later than 31 December 2013, at the TDEI website (http://www.cloznet.com/ieeetdei) in accordance with the template. Papers submitted after this date will be considered but may not meet the printing deadline and, if accepted, will be included in subsequent regular issues
Instructions for preparation of manuscripts and a template are available at the website. The TDEI template may be obtained from http://www.cloznet.com/ieeetdei/TDEI%20Template.doc Submissions should be marked during the submission process as special issue contributions by selecting in the submission form the guest editor for this issue. Questions regarding the Special Issue on High Voltage Direct Current (HVDC) Transmission Systems can be addressed to the Guest Editors:
University of Bologna
Viale del Risorgimento 2
40136 Bologna, Italy
|Gian Carlo Montanari
University of Bologna
Viale del Risorgimento 2
40136 Bologna, Italy
Delft University of Technology
2628 CD Delft, the Netherlands