IEEE
March 30th, 2014

CALL FOR PAPERS

Special Issue of the

IEEE Transactions on Dielectrics and Electrical Insulation on

Power Modulators and Repetitive Pulsed Power 

We are pleased to announce that the August 2015 issue of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) will be a special issue on Power Modulators, Repetitive Pulsed Power and High Voltage topics. This issue is open to all authors; presenters of papers at the IEEE International Power Modulator and High Voltage Conference (2014 IPMHVC) are especially encouraged to submit their work to this special issue. Topics include, but are not restricted to:

  • Repetitive Pulsed Power for Research and Applications
  • Power Conditioning and Pulse Shaping, Power Electronics and Prime Power Systems
  • Compact Pulsed Power Systems
  • Plasma Opening and Closing Switches, Solid State Modulators and Switches
  • Dielectric Breakdown, High Voltage Components and Energy Storage
  • High Voltage Design, Testing and Analysis
  • High Power Microwaves, Radiating Structures, HF Techniques
  • Lasers, Accelerators, Electromagnetic Launchers and High Energy Systems

In accordance with IEEE policy, papers that have been published in any conference proceedings cannot be republished. A plagiarism tool will be used to verify originality. Therefore, authors of the 2014 IPMHVC proceedings are strongly advised to significantly expand and enhance their conference paper versions prior to submission to this Special Issue of the IEEE TDEI.

Authors are invited to submit their papers to the Guest Editors of the Special Issue no later than September 30, 2014, at the TDEI website (http://www.cloznet.com/ieeetdei) in accordance with the template. Instructions for preparation of manuscripts and a template are available at the website. The TDEI template may be obtained from http://www.cloznet.com/ieeetdei/TDEI%20Template.doc

Submissions should be marked during the submission process as special issue contributions by selecting in the submission form the “Guest Editor” link and choosing the guest editor for this issue. Questions regarding the Special Issue on Power Modulators and Repetitive Pulsed Power can be addressed to the Guest Editors:

Dr. Frank Hegeler

Naval Research Laboratory / CTI

Code 6730

4555 Overlook Ave., SW

Washington, DC 20375

USA

Tel: (202) 404-4440

Fax: (202) 767-0046

frank.hegeler.ctr@nrl.navy.mil

 

March 27th, 2014

CALL FOR NOMINATIONS

DEIS ADMINISTRATIVE COMMITTEE (AdCom)

AdCom manages the affairs of the IEEE Dielectrics and Electrical Insulation Society (DEIS). It is made up of 18 members-at-large, plus ex-officio members.

Nominations And Appointment Committee is inviting nomination for President, Administrative Vice President, and Technical Vice President and 6 AdCom Members-at-Large of DEIS.

Persons nominated must be IEEE-DEIS members in good standing. Traditionally, AdCom has maintained a balance in representation between the industrial and academic communities.

Members-at-Large of AdCom:  Each year 6 members-at-large are elected to serve a 3-year term on the DEIS AdCom. No member-at-large can serve more than two consecutive terms. The 6 Members-at-Large who will begin their service in 2015 will be elected by the membership of the Society by electronic or postal ballot conducted by IEEE staff. Persons elected or appointed will begin their service as of 1 January 2015.

The deadline for the Members-at-Large nominations is 28 May 2014.

Officers:  President, Administrative Vice President, and Technical Vice President are the Officers of the society and serve a 1-year term and are eligible to serve for a second term. The Officers for 2014 will be appointed by AdCom at its meeting in the autumn of 2014.

The deadline for nominations for the Officers is 31 August 2014.

Each nominee will be contacted by the Nominations & Appointments Committee and will be asked to submit information relevant to the election and appointment process.  Self-nominations are also permitted.

The following information is needed for each person nominated.

Name (Last, First):

Position held / Institution name:

DEIS position being nominated for:

Phone number:

e-mail address:

 

Please send your nominations by the deadline to:

Masoud Farzaneh,

Chair, DEIS Nominations & Appointments Committee

farzaneh@uqac.ca

For information on the process see the DEIS Operations Manual at

http://sites.ieee.org/deis/files/2012/10/deisOperManR24.pdf

 

March 27th, 2014

Volunteers needed for IEEE Awards

The IEEE Awards Board seeks new volunteers to serve on its award selection committees and Awards Board standing committees to assist with managing the recipient nomination and selection process for IEEE Medals, Technical Field Awards, and Recognitions, the highest awards IEEE presents on behalf of the IEEE Board of Directors.

To apply to serve on an award selection committee or as a member of one of the following Awards Board’s (AB) committees, visit the IEEE Awards Board Nominations and Appointments Web page.

-          AB Awards Review Committee

-          AB Planning and Policy Committee

-          AB Finance Committee

-          AB Presentation and Publicity Committee

-          AB Joint Awards with National Societies Committee

-          Medals Council

-          Technical Field Awards Council

-          Recognitions Council

 

 

March 27th, 2014

Call for Nominations: IEEE Medals and Recognition

Nominations are due 1 July 2014 for the 2015 IEEE Medals and Recognitions.  IEEE Medals are the highest recognition within the IEEE awards hierarchy, with the prestigious IEEE Medal of Honor as the premier award.  IEEE Medals embrace broad and significant contributions within the technical fields of interest of IEEE.

IEEE Recognitions reward member’s individual contributions to IEEE, published papers, and corporate advancements within the IEEE fields of interest.

Recipients are recognized at the formal IEEE Honors Ceremony.  All IEEE members are encouraged to submit a nomination for a worthy candidate within their technical fields.

For more information visit www.ieee.org/awards or email awards@ieee.org.

 

 

March 2nd, 2014

IEEE Electrical Insulation Conference Authors announcement: the date for submission of papers has been extended to March 12, 2014.

Please go to http://sites.ieee.org/eic for more information!

February 25th, 2014

2014 Thomas W Dakin Distinguished Technical
Contributions Award

Recipient: Prof. John Fothergill

John Fothergill Portrait HR

City University London, UK

John will receive the Dakin Award at the 2014 EIC, Philadelphia, PA, June 8-11,
2014.

February 23rd, 2014

Dielectrics and High Voltage Research Laboratories

DEIS is collecting the names and weblinks of dielectrics and high voltage research laboratories, which will be posted on the DEIS website. If your laboratory should be included in this list, please provide the laboratory name, country, and weblink and e-mail it to  frank.hegeler(at)nrl.navy.mil

 

 

February 23rd, 2014

DEIS joined a group of IEEE societies called Sister Societies, which includes the Industry Applications Society (IAS), Industrial Electronics Society (IES), Power Electronics Society (PELS), and the Power & Energy Society (PES). DEIS will work closely with IAS, IES, PELS, and PES on Membership, Chapters, Conferences, Publications, and Standards, and this relationship will provide additional benefits to the DEIS members.

February 13th, 2014

Message from the DEIS President

195-small.jpg (1 of 1)

(November 5, 2013)

 Year 2013 has been remarkable for DEIS in term of realisation and structural changes.

It particularly marks the 50th anniversary of our Society, which has been commemorated in various ways, mainly by the publication of 9 fifty-year review articles in the Magazine with 3 more to appear in the January/February 2014 issue, together with an editorial on the founding meeting of the Society in the same issue.

The society has proceeded with a number of operational improvements, in particular with its website, now with more attractive features for better communication with its member and direct access to the Society’s procedures and activities. Key improvement targets suggested to AdCom have resulted in a number of ameliorations in various activities and in new initiatives:

  1. Targeted recruiting approach resulted in an increase in membership, now standing close to 2,300, with a notable increase for student and Gold Membership. In Publications, procedures are being implemented for a more systematic control of papers for plagiarism and for reducing time from paper submission to publication. Also, the process for merging of the ICDL and ICSD conferences is moving forward. For the Technical Activities, a forum on the DEIS website and a formal review of those activities are underway. As concerns Education, the Student Fellowship program has been restructured and more emphasis is being put on producing videos of lectures of technical interest to be loaned to members and teaching staff in universities or schools.  Chapters are now reaching more than 1,300 people, with three new chapters, in Africa, China, and Mexico, being close to being formed, in addition to the 11 active ones. It is worth to mention that the newly created Kolkota Chapter, in India, has set up the new CATCON conference, technically sponsored by DEIS, which promises to be very successful.
  2. An Executive Committee, composed of the President, Administrative and Technical Vice Presidents, past President, Treasurer, Secretary and the chairs of the Publications and Meetings committees, has been created. Its scope includes discussion of future orientations and the development of high-level strategies for proposing to AdCom.
  3. A new Distinguished Lecturers Program to ensure top quality and steady supply of lectures for the Chapters was established, under the management of the Awards and Recognition committee.
  4. A Regional Ambassador Program has been established to promote DEIS worldwide, create new Chapters and increase cooperation among them. It will first be started in China as a pilot project with the nomination of Dr. Mingli Fu as Ambassador.
  5. Successful efforts have been made to set foot in China. In addition to nominating an Ambassador, a Chapter has been initiated and is about to be recognized. CEIDP 2013 has been held last October in Shenzhen, outside of North America for the first time, which was a great success with more than 300 papers presented. This was immediately followed by a reception where foremost Chinese experts from academia and industry had been invited and were informed by DEIS officers and chairs of administrative committees on the services and activities of DEIS.
  6. It was decided to join the IEEE Sister Societies (PES, PELS, IAS, IES), for collaboration around the development and professional activities, for mutual benefits. Also, a link has been established with INMR allowing increased membership, especially from the industry, with Dr. W.A. Chisholm acting as liaison between DEIS and INMR.
  7. DEIS will be reviewed by the IEEE TAB Society Review Committee in November. Considering that DEIS is doing well in all its important activities including publications, membership, sponsored conferences, active chapters, updated by-laws, regular meetings of its AdCom, and updated and rejuvenated technical activities, we are confident to go through the review process with flying colors.

My increasing workload and responsibilities at national and international levels did not unfortunately allow me to run for a second-year mandate. However, I will continue to serve the Society in 2014 as immediate Past President.

At the last AdCom meeting, Frank Hegeler, Paul Lewin and Reimund Gerhard were elected respectively as new President, Administrative Vice President and Technical Vice President, for 2014. We wish them all success in their positions.

Finally, I would like to take this occasion to sincerely thank the Administrative Committee for their trust, support, collaboration and leadership which will contribute to make this 50th anniversary a memorable year in the history of DEIS.

Respectfully,

Masoud Farzaneh, President

IEEE DEIS

February 3rd, 2014

CALL FOR PAPERS

Special Issue of the

IEEE Transactions on Dielectrics and Electrical Insulation

on

Electrets and Related Phenomena

 

We are pleased to announce that the June 2015 issue of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) will be a special issue on electrets and related phenomena.  This issue is open to all authors. Presenters of papers at the IEEE 15th International Symposium on Electrets (ISE15) to be held during August 10-13, 2014 in Baltimore (USA) are especially encouraged to submit their work to this special issue. For more information on ISE15 please go to www.ise15.org.

Topics include, but are not limited to:

  • Charge (injection/formation, transport, trapping,      measurement) related phenomena in dielectrics
  • Dielectric responses under high electric field
  • Soft actuators & sensors
  • Ferro-/piezo-electric phenomena in polymers and organics/biomaterials
  • Applications of organic and polymer based      ferro-/piezo-electric materials
  • Energy storage in dielectrics and ionic materials
  • Electrocaloric and pyroelectric materials
  • Electrets for energy harvesting: principle,      design, characterization, and applications
  • Electrets and functional polymers in organic      electronics
  • Non-linear electrical and optical effects:      photoelectrets
  • Electrostatic and dielectric phenomena in life      science and bioelectrets
  • Electro-electrets: ferroelectret and      dielectric-elastomer transducers
  • Nanoscale characterization of electrostatic,      dielectric and electret materials
  • Electret and dielectric phenomena in nanoscale      structures/configuration
  • Dielectric and space charge relaxation in      polymers and organics
  • Thermally stimulated currents

Authors are invited to submit their papers to the Guest Editors of the Special Issue no later than August 31, 2014, at the TDEI website (http://www.cloznet.com/ieeetdei). On the submission form there is a location for Special Issue paper submission where the name of the Guest Editor is to be chosen. Instructions for the preparation of manuscripts and a template are available at the website or directly from:

http://www.cloznet.com/ieeetdei/TDEI%20Template.doc

In accordance with IEEE policy, papers that have been published in any Conference proceedings cannot be republished. Therefore, authors of the 2014 IEEE ISE15 are strongly advised to significantly expand and enhance their conference papers version prior to submission to this Special Issue of the IEEE TDEI.

Further questions concerning this Special Issue could be directed to either one of the two Guest Editors or directly to the Editor-in-Chief of the IEEE Transaction on Dielectrics and Electrical Insulation Professor Reuben Hackam (hackam@uwindsor.ca)

The Guest Editors for this special issue are:

Qiming Zhang

Department of Electrical Engineering

and Materials Research Institute

N219 Millennium Science Complex

The Pennsylvania State University

University Park, PA 16802, USA

Tel: 814-863-8994

qxz1@psu.edu

 

Michael (Seungju) Yu

Department of Bioengineering

University of Utah

4501 SMBB, 36 S. Wasatch Drive

Salt Lake City, UT 84112, USA

Tel: 801-587-1264

michael.yu@utah.edu