The 2014 Electrical Insulation Conference to be held in Philadelphia from June 8-11, 2014 has posted the final conference program: http://sites.ieee.org/eic/files/2013/04/EIC-2014-Final-Program-for-Website.pdf
Essay competition for IEEE Young Professionals and Student Members
To take part, write a 1000-word essay on a recently published IEEE Explore paper which you have read, explaining its relevance to your work. The authors of the paper must not be affiliated with your institution. In your essay expand on the following points:
- 1. The reasons why the paper was selected
- 2. Its impact on your work
- 3. Your work versus the work presented in the paper
- 4. The influence which the paper has had on your thinking and your ideas for future work.
Please note that equations, references, tables and diagrams should NOT be included in the essay. The winning essay will be published on the DEIS website and in the IEEE Electrical Insulation Magazine. The essays of the two runners-up will also be published on the DEIS website. The winning candidate and the two runners up will each receive a certificate from DEIS carrying her/his name, affiliation and the title of the essay, and an Amazon voucher. The values of the vouchers will be $150 for the winner, and $100 for each runner-up. For more details click here.
Submission deadline via the DEIS website: 31 October 2014
Announcement of results on the DEIS website: 12 January 2015
Publication of the winning essays by: 1 May 2015
Announcement by: Antonios Tzimas- Chair of IEEE DEIS Young Professionals Membership
Andrea Cavalini – Chair of the IEEE DEIS Education Committee
Submit Via DropBox
CALL FOR PAPERS
Special Issue of the
IEEE Transactions on Dielectrics and Electrical Insulation on
Power Modulators and Repetitive Pulsed Power
We are pleased to announce that the August 2015 issue of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) will be a special issue on Power Modulators, Repetitive Pulsed Power and High Voltage topics. This issue is open to all authors; presenters of papers at the IEEE International Power Modulator and High Voltage Conference (2014 IPMHVC) are especially encouraged to submit their work to this special issue. Topics include, but are not restricted to:
- Repetitive Pulsed Power for Research and Applications
- Power Conditioning and Pulse Shaping, Power Electronics and Prime Power Systems
- Compact Pulsed Power Systems
- Plasma Opening and Closing Switches, Solid State Modulators and Switches
- Dielectric Breakdown, High Voltage Components and Energy Storage
- High Voltage Design, Testing and Analysis
- High Power Microwaves, Radiating Structures, HF Techniques
- Lasers, Accelerators, Electromagnetic Launchers and High Energy Systems
In accordance with IEEE policy, papers that have been published in any conference proceedings cannot be republished. A plagiarism tool will be used to verify originality. Therefore, authors of the 2014 IPMHVC proceedings are strongly advised to significantly expand and enhance their conference paper versions prior to submission to this Special Issue of the IEEE TDEI.
Authors are invited to submit their papers to the Guest Editors of the Special Issue no later than September 30, 2014, at the TDEI website (http://www.cloznet.com/ieeetdei) in accordance with the template. Instructions for preparation of manuscripts and a template are available at the website. The TDEI template may be obtained from http://www.cloznet.com/ieeetdei/TDEI%20Template.doc
Submissions should be marked during the submission process as special issue contributions by selecting in the submission form the “Guest Editor” link and choosing the guest editor for this issue. Questions regarding the Special Issue on Power Modulators and Repetitive Pulsed Power can be addressed to the Guest Editors:
Dr. Frank Hegeler
Naval Research Laboratory / CTI
4555 Overlook Ave., SW
Washington, DC 20375
Tel: (202) 404-4440
Fax: (202) 767-0046
CALL FOR NOMINATIONS
DEIS ADMINISTRATIVE COMMITTEE (AdCom)
AdCom manages the affairs of the IEEE Dielectrics and Electrical Insulation Society (DEIS). It is made up of 18 members-at-large, plus ex-officio members.
Nominations And Appointment Committee is inviting nomination for President, Administrative Vice President, and Technical Vice President and 6 AdCom Members-at-Large of DEIS.
Persons nominated must be IEEE-DEIS members in good standing. Traditionally, AdCom has maintained a balance in representation between the industrial and academic communities.
Members-at-Large of AdCom: Each year 6 members-at-large are elected to serve a 3-year term on the DEIS AdCom. No member-at-large can serve more than two consecutive terms. The 6 Members-at-Large who will begin their service in 2015 will be elected by the membership of the Society by electronic or postal ballot conducted by IEEE staff. Persons elected or appointed will begin their service as of 1 January 2015.
The deadline for the Members-at-Large nominations is 28 May 2014.
Officers: President, Administrative Vice President, and Technical Vice President are the Officers of the society and serve a 1-year term and are eligible to serve for a second term. The Officers for 2014 will be appointed by AdCom at its meeting in the autumn of 2014.
The deadline for nominations for the Officers is 31 August 2014.
Each nominee will be contacted by the Nominations & Appointments Committee and will be asked to submit information relevant to the election and appointment process. Self-nominations are also permitted.
The following information is needed for each person nominated.
Name (Last, First):
Position held / Institution name:
DEIS position being nominated for:
Please send your nominations by the deadline to:
Chair, DEIS Nominations & Appointments Committee
For information on the process see the DEIS Operations Manual at
Volunteers needed for IEEE Awards
The IEEE Awards Board seeks new volunteers to serve on its award selection committees and Awards Board standing committees to assist with managing the recipient nomination and selection process for IEEE Medals, Technical Field Awards, and Recognitions, the highest awards IEEE presents on behalf of the IEEE Board of Directors.
To apply to serve on an award selection committee or as a member of one of the following Awards Board’s (AB) committees, visit the IEEE Awards Board Nominations and Appointments Web page.
- AB Awards Review Committee
- AB Planning and Policy Committee
- AB Finance Committee
- AB Presentation and Publicity Committee
- AB Joint Awards with National Societies Committee
- Medals Council
- Technical Field Awards Council
- Recognitions Council
Call for Nominations: IEEE Medals and Recognition
Nominations are due 1 July 2014 for the 2015 IEEE Medals and Recognitions. IEEE Medals are the highest recognition within the IEEE awards hierarchy, with the prestigious IEEE Medal of Honor as the premier award. IEEE Medals embrace broad and significant contributions within the technical fields of interest of IEEE.
IEEE Recognitions reward member’s individual contributions to IEEE, published papers, and corporate advancements within the IEEE fields of interest.
Recipients are recognized at the formal IEEE Honors Ceremony. All IEEE members are encouraged to submit a nomination for a worthy candidate within their technical fields.
2014 Thomas W Dakin Distinguished Technical
Recipient: Prof. John Fothergill
City University London, UK
John will receive the Dakin Award at the 2014 EIC, Philadelphia, PA, June 8-11,
Dielectrics and High Voltage Research Laboratories
DEIS is collecting the names and weblinks of dielectrics and high voltage research laboratories, which will be posted on the DEIS website. If your laboratory should be included in this list, please provide the laboratory name, country, and weblink and e-mail it to frank.hegeler(at)nrl.navy.mil
DEIS joined a group of IEEE societies called Sister Societies, which includes the Industry Applications Society (IAS), Industrial Electronics Society (IES), Power Electronics Society (PELS), and the Power & Energy Society (PES). DEIS will work closely with IAS, IES, PELS, and PES on Membership, Chapters, Conferences, Publications, and Standards, and this relationship will provide additional benefits to the DEIS members.