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As flat as it gets: the first 2D microprocessor

Chip manufacturers are at work to develop 3D structures that can support ever denser processing and storage capabilities. In February 2017 Toshiba has introduced the first 3D flash chip storage stacking 64 layers, and in April 2017 SK Hynix unveiled a 73 layer 256Gb 3D NAND memory. Yet, as industry …

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