IEEE EMC Society Huntsville Chapter

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Archive for the ‘Round Table’ Category

Circuit Board Design Roundtable

Tuesday, April 30th, 2013
The Huntsville chapter of the IEEE Electromagnetic Compatibility (EMC) Society invites you to attend a technical meeting on May 16, 2013.  The meeting will be held at Adtran, Mark C. Smith Conference center, East Tower, Training Room 273.  The program will begin at 5:30 pm with Doug Gricius of Tektronix, sponsoring a free catered meal.  The roundtable discussion will begin at approximately 6:20 pm after some short chapter status updates.

Meal Sponsor:

Doug Gricius

Tektronix

“South of the Border Meal”

Enchilada Casserole, Chicken Fajitas, Tortilla Chips, Cheese and Salsa,
Refried Beans, Sour Cream, Jalapenos, Shredded Lettuce, Tomatoes,
Churros, Sweet/Unsweet Tea and 
Water

 

Presentation Topic:

“Roundtable Discussion on Circuit Board Design”

 

Meeting Location: Adtran, Mark C. Smith Conference center. East Tower, Training Room 273

Date: May 16, 2013

Time: 5:30 p.m.

 

For the May technical meeting the chapter is trying something new again .  The meeting will be a roundtable discussion, where the chapter members can ask questions to the panel.

 

The Panel will consist of:

  • Lon Brolliar, Technology Service Corp. – Mixed analog and digital design, high speed digital (GHz plus), RF, and PCB layout and manufacture
  • David Cavanaugh, Benchmark Electronics – Signal integrity, electronic components, instrumentation, applications of components, the physics and material science related to electronic components
  • Skip Grierson, Adtran – Hardware Design
  • Hugh Montgomery, SCI-Samina – Military audio systems and processor designs, high speed and mixed signal, power supplies and filters, ESD, and grounding and shielding strategies
  • Curtis Neely, SCI-Samina – Intercommunication systems (both aircraft and ground based platforms), digital, analog, and mixed signal circuitry as well as DC/DC converters

 

If you have a question(s) for one of the panel members, please submit your question to Tom Perry at thomas.a.perry@nasa.gov by May 8, 2013.  All questions will be posted section below.

Thanks!

 

August 2012 Roundtable Discussion Questions

Tuesday, August 21st, 2012
  • How do you calculate the diff mode and common mode inductance for filters to meet MIL-STD-461 conducted emission spec on a 28 VDC line?
  • What are typical differences between an military standard evaluation for airborne equipment and an evaluation for NASA?
  • Please explain the results at the IC pin interface one is trying to achieve when apply ESD protection circuitry. Is it limiting the voltage at the IC to a maximum voltage and if so what is that voltage (e.g. Is it the part’s absolute maximum voltage for that pin, a percentage above the absolute maximum?, etc.) or is it just a circuit survivability test (i.e. Whether or not the protection is adequate is determined by empirical data.)
  • Can you describe an EMI/EMC test where the procedures and/or results had a unexpected/surprising outcome? Did this (or could this) experience lead to a revision to the test standards?
  • Do you see areas where test standards need to be revised to keep up with changes in technology?
  • Which MIL-STD-704F tests (TAC & LDC) apply to a ground power unit supplying 115 VAC, 400 Hz, 3 cycle power and 28 VDC to an aircraft?
  • From the EME/EMI perspective, what is the life cycle of a piece of equipment? Is there a time in the life cycle that the requirements would change or have to be re-verified?
  • How would you check a bonded joint to have a resistance of less than ‘X’ Ωs during the design phase of a system. That is to say how would you calculate the resistance and what information would you use?
  • What is the evolution of 2.5 mΩ as the “golden standard” for RF bonding Where did it come from?
  • Given the reliance on 2.5 mΩ as the “golden standard” for RF bonding does it really give any indication of bond performance?