IEEE EMC Society Huntsville Chapter


Archive for the ‘Round Table’ Category

Circuit Board Design Roundtable

Tuesday, April 30th, 2013
The Huntsville chapter of the IEEE Electromagnetic Compatibility (EMC) Society invites you to attend a technical meeting on May 16, 2013.  The meeting will be held at Adtran, Mark C. Smith Conference center, East Tower, Training Room 273.  The program will begin at 5:30 pm with Doug Gricius of Tektronix, sponsoring a free catered meal.  The roundtable discussion will begin at approximately 6:20 pm after some short chapter status updates.

Meal Sponsor:

Doug Gricius


“South of the Border Meal”

Enchilada Casserole, Chicken Fajitas, Tortilla Chips, Cheese and Salsa,
Refried Beans, Sour Cream, Jalapenos, Shredded Lettuce, Tomatoes,
Churros, Sweet/Unsweet Tea and 


Presentation Topic:

“Roundtable Discussion on Circuit Board Design”


Meeting Location: Adtran, Mark C. Smith Conference center. East Tower, Training Room 273

Date: May 16, 2013

Time: 5:30 p.m.


For the May technical meeting the chapter is trying something new again .  The meeting will be a roundtable discussion, where the chapter members can ask questions to the panel.


The Panel will consist of:

  • Lon Brolliar, Technology Service Corp. – Mixed analog and digital design, high speed digital (GHz plus), RF, and PCB layout and manufacture
  • David Cavanaugh, Benchmark Electronics – Signal integrity, electronic components, instrumentation, applications of components, the physics and material science related to electronic components
  • Skip Grierson, Adtran – Hardware Design
  • Hugh Montgomery, SCI-Samina – Military audio systems and processor designs, high speed and mixed signal, power supplies and filters, ESD, and grounding and shielding strategies
  • Curtis Neely, SCI-Samina – Intercommunication systems (both aircraft and ground based platforms), digital, analog, and mixed signal circuitry as well as DC/DC converters


If you have a question(s) for one of the panel members, please submit your question to Tom Perry at by May 8, 2013.  All questions will be posted section below.



August 2012 Roundtable Discussion Questions

Tuesday, August 21st, 2012
  • How do you calculate the diff mode and common mode inductance for filters to meet MIL-STD-461 conducted emission spec on a 28 VDC line?
  • What are typical differences between an military standard evaluation for airborne equipment and an evaluation for NASA?
  • Please explain the results at the IC pin interface one is trying to achieve when apply ESD protection circuitry. Is it limiting the voltage at the IC to a maximum voltage and if so what is that voltage (e.g. Is it the part’s absolute maximum voltage for that pin, a percentage above the absolute maximum?, etc.) or is it just a circuit survivability test (i.e. Whether or not the protection is adequate is determined by empirical data.)
  • Can you describe an EMI/EMC test where the procedures and/or results had a unexpected/surprising outcome? Did this (or could this) experience lead to a revision to the test standards?
  • Do you see areas where test standards need to be revised to keep up with changes in technology?
  • Which MIL-STD-704F tests (TAC & LDC) apply to a ground power unit supplying 115 VAC, 400 Hz, 3 cycle power and 28 VDC to an aircraft?
  • From the EME/EMI perspective, what is the life cycle of a piece of equipment? Is there a time in the life cycle that the requirements would change or have to be re-verified?
  • How would you check a bonded joint to have a resistance of less than ‘X’ Ωs during the design phase of a system. That is to say how would you calculate the resistance and what information would you use?
  • What is the evolution of 2.5 mΩ as the “golden standard” for RF bonding Where did it come from?
  • Given the reliance on 2.5 mΩ as the “golden standard” for RF bonding does it really give any indication of bond performance?