On behalf of IEEE Ottawa Section, Carleton University and other IEEE Local chapters, The IEEE Kingston Section wishes to announce the following interesting Workshop to be held as indicated below and in the brochure:
2nd IEEE International Workshop on High-Performance Chip, Package and Systems
Nov. 16, 2013; 5050MC, Carleton University, Ottawa, Canada
On behalf of the HPCPS-2013 Steering Committee, we are glad to extend the Early Bird Registration (discounted) fees for HPCPS-2013,2nd IEEE International Workshop on High-Performance Chip, Package and Systems, to be held on Nov. 16, 2013, in Ottawa and the participants are encouraged to take advantage of the same.
The program for the HPCPS-2013 is posted on the Conference Program link. This year’s program features 8 invited talks from eminent researchers and leaders in the area, including, Keynote Speeches, Invited Talks and Distinguished Lectures from:
Prof. Madhavan Swaminathan, Fellow IEEE, Director IRC, Georgia Tech, Atlanta, USA
Prof. Farid Najm, Fellow IEEE, Chair, Dept. of ECE, University of Toronto
Prof. Luca Daniel, Dept. of ECE, MIT, Cambridge, MA, USA
Prof. Q. J. Zhang, Fellow IEEE, Dept. of Electronics, Carleton University
Prof. Franco Maloberti, Fellow IEEE, Uni. of Pavia, Pavia, Italy
Dr. Wendem Beyene, Technical Director, Rambus Inc., Sunnyvale, CA, USA
Dr. Dipanjan Gope, VP R&D, Nimbic Inc., Seattle, Washington, USA
Prof. Mircea R. Stan, Dept. of EE, Univ. of Virginia Charlottesville, VA, USA
HPCPS is pleased to announce 25 student awards in the form of free/discounted registrations (depending on IEEE Membership) on a first-come-first-serve basis. To be considered for the award, please fill up theApplication-Form and submit it by 10th Nov. 2013 to email@example.com.
HPCPS is focused on the emerging high-performance electronic chip, packages and systems. Major theme of the workshop is focused on the co-design, modeling and analysis of the mixed-domain issues arising due to the high-speed, high-density and low-power requirements that are demanded from today’s chip, interconnect, package and systems. Particular emphasis is also placed on signal and power integrity and electromagnetic compatibility in modern designs. Emerging techniques and methodologies for mixed-domain integration of diverse modules such as novel interconnects, optical components, RF devices and MEMS with electronic chips and packages are also considered.
HPCPS-2013 is supported by the IEEE Circuits and Systems Society, IEEE Ottawa Section, several local chapters of the IEEE and Carleton University.
Please feel free to circulate this information among your organizations and we look forward to seeing you in the HPCPS-2013.