|The University of Arkansas’ Institute of Electrical and Electronics Engineers (IEEE) Women in Engineering (WIE) chapter is holding its Fall 2018 Kick-Off, Friday, August 24 12pm – 1pm!
Join WIE for a luncheon (pizza will be provided) and listen in on guest speaker, Dr. Lauren Boteler, as she gives us an inside look at her work with the U.S. Army Research Laboratory.
This is an excellent opportunity to network with WIE members and sign up to join the organization! If you can’t make it to the luncheon, feel free to email any WIE officer:
President: Allison Rucker | firstname.lastname@example.org
Vice President: Cecily Redman | email@example.com
Secretary: Sarah Colpitts | firstname.lastname@example.org
About the Speaker:
Dr. Lauren Boteler leads the thermal and packaging research programs as part of the Advanced Power Packaging group at the U.S. Army Research Laboratory (ARL) located in Adelphi, MD. She received her B.S. and Ph.D. degrees in mechanical engineering from the University of Maryland in 2006 and 2011, respectively. Her work at ARL, beginning in 2005, has focused on electronics packaging and thermal management solutions for a wide range of Army applications. She designs thermal and packaging solutions including 3D chip stacking, power electronics, RF HEMT devices, top side cooling, phase change materials, additive manufacturing, MEMS, and thermoelectric modules. More recently, she has initiated a research program in Advanced Power Electronics Packaging and Thermal Management which focuses on four main challenges of power electronics packaging: transient thermal mitigation, additive manufacturing, coengineering/codesign, and high-voltage packaging. Outside of work, she is passionate about renewable technology, reading and travelling.
This event will be located at Bell Engineering Center, in the Electrical Engineering Student Lounge (BELL 3008).
Friday, August 24
Name: Robert Saunders