The January 2017 edition of the IEEE Phoenix Section newsletter “Valley Megaphone” is now available. The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.
IEEE MTT-S Young Professionals in Microwaves will be organizing a workshop on 16th January 2017 from 4:40pm-6:30 pm MST as a part of Radio Wireless Week 2017. The workshop will provide you a platform to share your knowledge with others, directly speak and network with the executives of the wireless industry. It’s a great opportunity to network and meet experts and young professionals all over phoenix.
Workshop will aim at: Shaping the Career for the Next Generation Wireless Technologies
- Paul Hart: Senior Vice President of RF Power at NXP Semiconductors
- Bob Sankman: Fellow, Intel
- Fred Schindler: Design Center Director, Qorvo
- Carl A. Davenport: General Manager of Product Development Engineering and Silicon Operations, IOT, Intel
2nd level, Phoenix East West Room
Register now at this link: https://mttsyprww.eventbrite.ca
The registration fees for the event is $50. Register before January 1, 2017 using the promo code “MTTSYP” to avail a $40 off. If you have registered for the RWW conference, you do not need to register for the event separately.
The December 2016 edition of the IEEE Phoenix Section newsletter “Valley Megaphone” is now available. The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.
ieee-phoenix-section-cpmt-society-chapter-november-16-2016-meeting-prof-muhannad-s-bakir2.5D and 3D IC Technology for Electronic Microsystems: Design Considerations and Experimental Demonstrations
Dr. Muhannad S. Bakir
Professor, School of Electrical & Computer Engineering, Georgia Institute of Technology
This presentation will address innovative interconnection and integration technologies for electronic microsystems. First, we discuss a highly scaled through-silicon via (TSV) technology for fine-grain heterogeneous electronic integration; we demonstrate TSVs with diameter of less than 1-micron for a wide range of applications. Next, we present innovative thermal solutions for 2.5D and 3D integration platforms using microfluidic cooling; the performance of a 28 nm CMOS FPGA with monolithic microfluidic cooling is demonstrated. Moreover, we analyze the thermal implication of silicon bridge technology in 2.5D systems. We also describe innovative ‘thermal isolation’ technologies in which thermal coupling between 3D IC stacks is minimized using an air-gap isolation and mechanically flexible interconnects. Lastly, an innovative sacrificial micro-fabricated self-alignment technology is also discussed as part of this application (sub-1 micron alignment accuracy is demonstrated without the use of a flip-chip bonder).
Dr. Muhannad Bakir is a Professor in the School of Electrical and Computer Engineering at Georgia Tech. His areas of interest include three-dimensional (3D) electronic system integration, advanced cooling and power delivery for 3D systems, biosensors and their integration with CMOS circuitry, and nanofabrication technology. Dr. Bakir is the recipient of the 2013 Intel Early Career Faculty Honor Award, 2012 DARPA Young Faculty Award, and 2011 IEEE CPMT Society Outstanding Young Engineer Award. In 2015, Dr. Bakir was elected by the IEEE CPMT Society to serve as a Distinguished Lecturer for a four-year term. Dr. Bakir and his research group have received more than twenty conference and student paper awards including five from the IEEE Electronic Components and Technology Conference (ECTC), four from the IEEE International Interconnect Technology Conference (IITC), and one from the IEEE Custom Integrated Circuits Conference (CICC). Dr. Bakir’s group was awarded the 2014 Best Paper of the IEEE Transactions on Components Packaging and Manufacturing Technology in the area of advanced packaging. Dr. Bakir is an Editor of IEEE Transactions on Electron Devices and an Associate Editor of IEEE Transactions on Components, Packaging and Manufacturing Technology.
The November 2016 edition of the IEEE Phoenix Section newsletter “Valley Megaphone” is now available. The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.
The IEEE Phoenix Section recognizes the contributions of members, non-members, society chapters, affinity groups, student branches, corporations, and educational institutions at the annual banquet. The next banquet is scheduled for Saturday, February 11th, 2017 at Phoenix Airport Marriott located at 1101 N. 44th Street, Phoenix, AZ 85008 from 5:30 PM to 9:30 PM (Tel: 602-273-7373).
The Section is pleased to issue a call for nominations for this year’s Section awards. The scope and purpose of the Section Awards Program is to plan, promote and implement IEEE award programs that recognize outstanding performance in furthering the objectives and professional aims of the IEEE Phoenix Section, the IEEE, and the IEEE-USA, and to stimulate others to pursue such achievements of excellence.
The IEEE Phoenix Section awards Student Scholarships to full-time graduate and undergraduate students who are IEEE student members. The applying student must attend a full academic year at a university in the Phoenix Section during 2016. The universities include Arizona State University, DeVry University, Embry-Riddle Aeronautical University, and Northern Arizona University.
The student must submit a completely filled application along with a financial aid statement; a one-page personal statement of achievements, interests, and goals; official transcripts of all college work; and two recommendation letters from the School’s faculty. The scholarships are awarded based on academic achievement, financial need, and service to the IEEE.