IEEE Phoenix Section

Including Northern Arizona

IEEE
April 6th, 2016

The April 2016 edition of the IEEE Phoenix Section newsletter “Valley  Megaphone” is now available.  The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.


March 10th, 2016

The March 2016 edition of the IEEE Phoenix Section newsletter “Valley  Megaphone” is now available.  The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.


February 11th, 2016

The February 2016 edition of the IEEE Phoenix Section newsletter “Valley  Megaphone” is now available.  The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.


January 16th, 2016

Wednesday, January 20th, 2016 at 5:30 PM

PLEASE NOTE THE CHANGE OF ENTRANCE (SEE MAP BELOW)

Understanding and Managing the Key Cost Drivers in PCB Design to Optimize Performance and Cost

Marc Licciardi

CEO and Lead Engineer

DfX Engineering

Scottsdale, AZ 85254 USA

marc@dfxengineering.com

ABSTRACT

Printed circuit boards have become increasingly complex and diverse in their applications and design. Processing sequences can be over fifty steps long, leading to a number of design choices. While the process is complex, the fundamental cost drivers can be broken into a few significant categories. These categories can be translated into specific design goals, which can then inform the best cost-performance optimized design. This presentation will step you through the optimization process and highlight the cost and performance choices.

BIOGRAPHY

Marc Licciardi is the founder of DfX Engineering. His work focuses on supporting large OEMs to develop cost- and performance-optimized PCB designs for applications ranging from very high-volume consumer devices to high-reliability data center networking devices. Prior to founding DfX Engineering, he was an SVP at Gold Circuit Electronics in Taiwan. He also held design engineering roles at Adflex Solutions, Hughes Aircraft and Parlex Corporation. He has worked on flex, rigid flex, wafer probes, substrates, standard and HDI PCB’s. Licciardi holds a BSIE degree from Worcester Polytechnic Institute.

Date:             Wednesday, January 20st, 2016

Location:       Constellation Conference Room, NXP Semiconductor, Inc., Discovery Business Center, 2100 E. Elliot Rd. Tempe, AZ. Enter the facility through the Main (South) Lobby in building 94 and sign in with Security (Photo ID required) BEFORE 6:00 PM. You will be escorted to the meeting room. The presentation promptly starts at 6:00 PM.

Agenda:        5:30–6:00 PM: Social/Refreshments, 6:00–7:00 PM: Presentation, 7:00 PM: Dinner

(Pizza and Soda will be provided by the IEEE Phoenix Section CPMT Society Chapter)NXPTempe_Map

IEEE members and non-members are all welcome to attend. Please arrive at the facility entrance no later than 5:45 PM.


January 14th, 2016

The January 2016 edition of the IEEE Phoenix Section newsletter “Valley  Megaphone” is now available.  The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.


December 6th, 2015

The December 2015 edition of the IEEE Phoenix Section newsletter “Valley  Megaphone” is now available.  The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.


December 5th, 2015

ieee_logo_mb_taglineThe IEEE Phoenix Section recognizes the contributions of members, non-members, society chapters, affinity groups, student branches, corporations, and educational institutions at the annual banquet. The next banquet is scheduled for Saturday, February 13th, 2016 at Hilton Phoenix Airport located at 2435 South 47th Street, Phoenix, AZ – 85034 from 5:30 PM to 9:30 PM (Tel: 480-894-1600).

The Section is pleased to issue a call for nominations for this year’s Section awards. The scope and purpose of the Section Awards Program is to plan, promote and implement IEEE award programs that recognize outstanding performance in furthering the objectives and professional aims of the IEEE Phoenix Section, the IEEE, and the IEEE-USA, and to stimulate others to pursue such achievements of excellence.

Read the rest of this entry »


November 9th, 2015

The November 2015 edition of the IEEE Phoenix Section newsletter “Valley  Megaphone” is now available.  The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.


November 6th, 2015

IEEE Components, Packaging and Manufacturing Technology Society

Phoenix Chapter

Wednesday, November 18th, 2015 at 5:30 PM

Film Assisted Molding: An Enabling Technology for Encapsulation of Advanced Packages

John Crane

JH Crane & Associates

Scottsdale, AZ 85266 USA

jhcrane@earthlink.net

ABSTRACT

The use of film in the transfer molding process, called Film Assist Molding (FAM), enables repeatable and high volume packaging for surfaces that must be kept free of mold compound, such as for Sensor/MEMS applications. Moreover, this encapsulation technology has provided the pathway for ever-increasing complex packages that are smaller and thinner, while compatible with superior mold compounds to meet the most stringent, cost effective customer device and package performance requirements. This presentation will introduce FAM, explore the possibilities and benefits of FAM to semiconductor encapsulation and explore implemented FAM solutions showing that it is possible to economically manufacture advanced packages of Sensors and MEMS in high volume production while achieving high device reliability.

Date:             Wednesday, November 18th, 2015

Location:       Group Conference Room, Freescale Semiconductor, Inc., Discovery Business Center, 2100 E. Elliot Rd. Tempe, AZ. Enter the facility through the Main (South) Lobby in building 94 and sign in with Security (Photo ID required) BEFORE 6:00 PM. You will be escorted to the meeting room. The presentation promptly starts at 6:00 PM.

Agenda:        5:30–6:00 PM: Social/Refreshments, 6:00–7:00 PM: Presentation, 7:00 PM: Dinner

(Pizza and Soda will be provided by the IEEE Phoenix Section CPMT Society Chapter)

IEEE members and non-members are all welcome to attend. Please arrive at the facility entrance no later than 5:45 PM.


October 11th, 2015

Power and Sensor Devices Driving Automotive Semiconductor Applications

Johannes M.C. (Hans) Stork

Senior VP and Chief Technology Officer

On Semiconductor

Phoenix, AZ 85008 USA

hans.stork@onsemi.com

ABSTRACT

Cars are increasingly driven by electronics to reduce human error, improve traffic flow and to meet environmental regulations. The semiconductor components that enable this functionality range from medium voltage discretes to replace relays to integrated, high-voltage motor drivers with re-programmability at high temperature. In this talk we will review the technology trends underlying the improvements in power discretes, such as IGBTs and GaN HEMT devices, the scaling trends and integration needs of high-voltage BCD CMOS flows, as well as the adjacent assembly challenges of power devices and power integrated modules.

BIOGRAPHY

Dr. Stork is Senior Vice President and Chief Technology Officer at ON Semiconductor. He oversees the development of wafer process technologies, modeling and design kits, IP libraries, as well as packaging technologies and assembly support.

Prior to joining ON Semiconductor, Dr. Stork was Group Vice President and Chief Technology Officer of the Silicon Systems Group at Applied Materials. From 2001 to 2007 he was Senior Vice President and the Chief Technology Officer of Texas Instruments. Before that, Dr. Stork held various R&D and management positions at Hewlett Packard Laboratories and at IBM’s T.J. Watson Research Center.

Dr. Stork serves on the supervisory board of ASML, is a member of the Scientific Advisory board at IMEC, and has previously served on the boards of Sematech and the SRC, and is a longstanding member of the SIA Technology Strategy Committee.

He has authored over 100 cited papers and holds eleven US patents. He was elected IEEE Fellow in 1994, and served on several IEEE sponsored conference program committees. He currently chairs the IEEE A. Grove Technical Field Award committee and is vice-chair of the Technical Field Awards council. Dr. Stork received the Ingenieur degree in electrical engineering from Delft University of Technology, Delft, The Netherlands, and holds a PhD in EE from Stanford University.

Date:             Wednesday, October 21st, 2015

Location:       Group Conference Room, Freescale Semiconductor, Inc., Discovery Business Center, 2100 E. Elliot Rd. Tempe, AZ. Enter the facility through the Main (South) Lobby in building 94 and sign in with Security (Photo ID required) BEFORE 6:00 PM. You will be escorted to the meeting room. The presentation promptly starts at 6:00 PM.

Agenda:        5:30–6:00 PM: Social/Refreshments, 6:00–7:00 PM: Presentation, 7:00 PM: Dinner

(Pizza and Soda will be provided by the IEEE Phoenix Section CPMT Society Chapter)

IEEE members and non-members are all welcome to attend. Please arrive at the facility entrance no later than 5:45 PM.