IEEE Phoenix Section

Including Northern Arizona

IEEE
June 8th, 2016

The June 2016 edition of the IEEE Phoenix Section newsletter “Valley  Megaphone” is now available.  The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.


June 5th, 2016

Understanding the Optical, Thermal, and Electrical Performances of LED and their Relationship to Efficiency of Solid-State Lighting

 Prof. Shi-Wei Ricky Lee, FIEEE, FASME, FIMAPS, FInstP

Professor of Mechanical & Aerospace Engineering, HKUST

Director of Center for Advanced Microsystems Packaging

Director of HKUST LED-FPD Technology R&D Center at Foshan

Senior Past-President of IEEE Components, Packaging and Manufacturing Technology Society

rickylee@ust.hk

 ABSTRACT

WYSIWYG (what you see is what you get) is an acronym in computer engineering to indicate the technology for matching the edited documents viewed on the monitor screen and its hardcopies in a printed format. In this presentation, I would like to illustrate a similar concept in LED packaging for solid-state lighting (SSL). LED has been claimed as the 4th generation light source which has the major merits of rather low power consumption and very long service life. Typical specifications include 150 lm/W and 50000 hours for luminous efficacy and operating life, respectively. However, it appears that not all people understand what these specifications refer to and imply. As a result, inappropriate expectation may occur due to misperception. In other words, what you see may not be what you thought. Consequently, such misunderstanding may hinder the propagation of LED for SSL. In this presentation, the essence in LED packaging to achieve WYSIWYT (what you see is what you thought) for SSL will be reviewed. Various topics on efficiencies and their corresponding loss channels at the LED package and luminaire levels will be discussed. Emphasis will be placed on the trends of LED packaging in order to achieve the intended performance.

BIOGRAPHY

Ricky Lee received his PhD degree from Purdue University in 1992. He joined the Hong Kong University of Science & Technology (HKUST) in 1993. During his career of tenure-track faculty at HKUST, Dr Lee once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute (NAMI) for two and a half years. Currently Dr Lee is Professor of Mechanical Engineering and Director of Center for Advanced Microsystems Packaging (CAMP) at HKUST. He also has a concurrent appointment as Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong, China. Due to his technical contributions, Dr Lee received many honors and awards over the years. In addition to being the recipient of 12 best/outstanding paper awards and 5 major professional society awards, Dr Lee is Life Fellow of ASME and IMAPS, and Fellow of IEEE and Institute of Physics (UK). He is also a Distinguished Lecturer and the Senior Past-President of the IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society.

Date:             Monday, June 6th, 2016

Location:       Constellation Room, NXP Semiconductors, Discovery Business Center, 2108 E. Elliot Rd. Tempe, AZ.

                     Note New Address – Park on east side of campus – New main entrance on south side facing Elliot. 

                     Sign in at the security station to obtain visitor pass (Photo ID required) BEFORE 6:00 PM

You will be escorted to the meeting room. Please arrive at the entrance no later than 5:45 PM.

Agenda:        5:30–6:00 PM: Social/Refreshments, 6:00–7:00 PM: Presentation, 7:00 PM: Dinner

                     The presentation promptly starts at 6:00 PM.

(Pizza and Soda will be provided by the IEEE Phoenix Section CPMT Society Chapter)

IEEE members and non-members are all welcome to attend.

IEEE Phoenix Section CPMT Society Chapter – June 6, 2016 Meeting – Prof. Ricky S.W. Lee


May 13th, 2016

The May 2016 edition of the IEEE Phoenix Section newsletter “Valley  Megaphone” is now available.  The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.


April 6th, 2016

The April 2016 edition of the IEEE Phoenix Section newsletter “Valley  Megaphone” is now available.  The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.


March 10th, 2016

The March 2016 edition of the IEEE Phoenix Section newsletter “Valley  Megaphone” is now available.  The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.


February 11th, 2016

The February 2016 edition of the IEEE Phoenix Section newsletter “Valley  Megaphone” is now available.  The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.


January 16th, 2016

Wednesday, January 20th, 2016 at 5:30 PM

PLEASE NOTE THE CHANGE OF ENTRANCE (SEE MAP BELOW)

Understanding and Managing the Key Cost Drivers in PCB Design to Optimize Performance and Cost

Marc Licciardi

CEO and Lead Engineer

DfX Engineering

Scottsdale, AZ 85254 USA

marc@dfxengineering.com

ABSTRACT

Printed circuit boards have become increasingly complex and diverse in their applications and design. Processing sequences can be over fifty steps long, leading to a number of design choices. While the process is complex, the fundamental cost drivers can be broken into a few significant categories. These categories can be translated into specific design goals, which can then inform the best cost-performance optimized design. This presentation will step you through the optimization process and highlight the cost and performance choices.

BIOGRAPHY

Marc Licciardi is the founder of DfX Engineering. His work focuses on supporting large OEMs to develop cost- and performance-optimized PCB designs for applications ranging from very high-volume consumer devices to high-reliability data center networking devices. Prior to founding DfX Engineering, he was an SVP at Gold Circuit Electronics in Taiwan. He also held design engineering roles at Adflex Solutions, Hughes Aircraft and Parlex Corporation. He has worked on flex, rigid flex, wafer probes, substrates, standard and HDI PCB’s. Licciardi holds a BSIE degree from Worcester Polytechnic Institute.

Date:             Wednesday, January 20st, 2016

Location:       Constellation Conference Room, NXP Semiconductor, Inc., Discovery Business Center, 2100 E. Elliot Rd. Tempe, AZ. Enter the facility through the Main (South) Lobby in building 94 and sign in with Security (Photo ID required) BEFORE 6:00 PM. You will be escorted to the meeting room. The presentation promptly starts at 6:00 PM.

Agenda:        5:30–6:00 PM: Social/Refreshments, 6:00–7:00 PM: Presentation, 7:00 PM: Dinner

(Pizza and Soda will be provided by the IEEE Phoenix Section CPMT Society Chapter)NXPTempe_Map

IEEE members and non-members are all welcome to attend. Please arrive at the facility entrance no later than 5:45 PM.


January 14th, 2016

The January 2016 edition of the IEEE Phoenix Section newsletter “Valley  Megaphone” is now available.  The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.


December 6th, 2015

The December 2015 edition of the IEEE Phoenix Section newsletter “Valley  Megaphone” is now available.  The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.


December 5th, 2015

ieee_logo_mb_taglineThe IEEE Phoenix Section recognizes the contributions of members, non-members, society chapters, affinity groups, student branches, corporations, and educational institutions at the annual banquet. The next banquet is scheduled for Saturday, February 13th, 2016 at Hilton Phoenix Airport located at 2435 South 47th Street, Phoenix, AZ – 85034 from 5:30 PM to 9:30 PM (Tel: 480-894-1600).

The Section is pleased to issue a call for nominations for this year’s Section awards. The scope and purpose of the Section Awards Program is to plan, promote and implement IEEE award programs that recognize outstanding performance in furthering the objectives and professional aims of the IEEE Phoenix Section, the IEEE, and the IEEE-USA, and to stimulate others to pursue such achievements of excellence.

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