IEEE Phoenix Section

Including Northern Arizona

IEEE

Archive for 2015

December 2015 Issue of Valley Megaphone

Sunday, December 6th, 2015

The December 2015 edition of the IEEE Phoenix Section newsletter “Valley  Megaphone” is now available.  The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.

IEEE Phoenix Section Awards For The Year 2015

Saturday, December 5th, 2015

ieee_logo_mb_taglineThe IEEE Phoenix Section recognizes the contributions of members, non-members, society chapters, affinity groups, student branches, corporations, and educational institutions at the annual banquet. The next banquet is scheduled for Saturday, February 13th, 2016 at Hilton Phoenix Airport located at 2435 South 47th Street, Phoenix, AZ – 85034 from 5:30 PM to 9:30 PM (Tel: 480-894-1600).

The Section is pleased to issue a call for nominations for this year’s Section awards. The scope and purpose of the Section Awards Program is to plan, promote and implement IEEE award programs that recognize outstanding performance in furthering the objectives and professional aims of the IEEE Phoenix Section, the IEEE, and the IEEE-USA, and to stimulate others to pursue such achievements of excellence.

(more…)

November 2015 Issue of Valley Megaphone

Monday, November 9th, 2015

The November 2015 edition of the IEEE Phoenix Section newsletter “Valley  Megaphone” is now available.  The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.

Friday, November 6th, 2015

IEEE Components, Packaging and Manufacturing Technology Society

Phoenix Chapter

Wednesday, November 18th, 2015 at 5:30 PM

Film Assisted Molding: An Enabling Technology for Encapsulation of Advanced Packages

John Crane

JH Crane & Associates

Scottsdale, AZ 85266 USA

jhcrane@earthlink.net

ABSTRACT

The use of film in the transfer molding process, called Film Assist Molding (FAM), enables repeatable and high volume packaging for surfaces that must be kept free of mold compound, such as for Sensor/MEMS applications. Moreover, this encapsulation technology has provided the pathway for ever-increasing complex packages that are smaller and thinner, while compatible with superior mold compounds to meet the most stringent, cost effective customer device and package performance requirements. This presentation will introduce FAM, explore the possibilities and benefits of FAM to semiconductor encapsulation and explore implemented FAM solutions showing that it is possible to economically manufacture advanced packages of Sensors and MEMS in high volume production while achieving high device reliability.

Date:             Wednesday, November 18th, 2015

Location:       Group Conference Room, Freescale Semiconductor, Inc., Discovery Business Center, 2100 E. Elliot Rd. Tempe, AZ. Enter the facility through the Main (South) Lobby in building 94 and sign in with Security (Photo ID required) BEFORE 6:00 PM. You will be escorted to the meeting room. The presentation promptly starts at 6:00 PM.

Agenda:        5:30–6:00 PM: Social/Refreshments, 6:00–7:00 PM: Presentation, 7:00 PM: Dinner

(Pizza and Soda will be provided by the IEEE Phoenix Section CPMT Society Chapter)

IEEE members and non-members are all welcome to attend. Please arrive at the facility entrance no later than 5:45 PM.

IEEE CPMT Society, Phoenix Chapter, Wednesday, October 21, 2015 Meeting

Sunday, October 11th, 2015

Power and Sensor Devices Driving Automotive Semiconductor Applications

Johannes M.C. (Hans) Stork

Senior VP and Chief Technology Officer

On Semiconductor

Phoenix, AZ 85008 USA

hans.stork@onsemi.com

ABSTRACT

Cars are increasingly driven by electronics to reduce human error, improve traffic flow and to meet environmental regulations. The semiconductor components that enable this functionality range from medium voltage discretes to replace relays to integrated, high-voltage motor drivers with re-programmability at high temperature. In this talk we will review the technology trends underlying the improvements in power discretes, such as IGBTs and GaN HEMT devices, the scaling trends and integration needs of high-voltage BCD CMOS flows, as well as the adjacent assembly challenges of power devices and power integrated modules.

BIOGRAPHY

Dr. Stork is Senior Vice President and Chief Technology Officer at ON Semiconductor. He oversees the development of wafer process technologies, modeling and design kits, IP libraries, as well as packaging technologies and assembly support.

Prior to joining ON Semiconductor, Dr. Stork was Group Vice President and Chief Technology Officer of the Silicon Systems Group at Applied Materials. From 2001 to 2007 he was Senior Vice President and the Chief Technology Officer of Texas Instruments. Before that, Dr. Stork held various R&D and management positions at Hewlett Packard Laboratories and at IBM’s T.J. Watson Research Center.

Dr. Stork serves on the supervisory board of ASML, is a member of the Scientific Advisory board at IMEC, and has previously served on the boards of Sematech and the SRC, and is a longstanding member of the SIA Technology Strategy Committee.

He has authored over 100 cited papers and holds eleven US patents. He was elected IEEE Fellow in 1994, and served on several IEEE sponsored conference program committees. He currently chairs the IEEE A. Grove Technical Field Award committee and is vice-chair of the Technical Field Awards council. Dr. Stork received the Ingenieur degree in electrical engineering from Delft University of Technology, Delft, The Netherlands, and holds a PhD in EE from Stanford University.

Date:             Wednesday, October 21st, 2015

Location:       Group Conference Room, Freescale Semiconductor, Inc., Discovery Business Center, 2100 E. Elliot Rd. Tempe, AZ. Enter the facility through the Main (South) Lobby in building 94 and sign in with Security (Photo ID required) BEFORE 6:00 PM. You will be escorted to the meeting room. The presentation promptly starts at 6:00 PM.

Agenda:        5:30–6:00 PM: Social/Refreshments, 6:00–7:00 PM: Presentation, 7:00 PM: Dinner

(Pizza and Soda will be provided by the IEEE Phoenix Section CPMT Society Chapter)

IEEE members and non-members are all welcome to attend. Please arrive at the facility entrance no later than 5:45 PM.

IEEE Phoenix Section Annual Banquet 2016

Friday, October 9th, 2015

Annual Banquet – Saturday, February 13th, 2016

Hilton Phoenix Airport, 2435 South 47th Street, Phoenix, Arizona 85034

Keynote Presentation

Title: Are there plenty more fish in the sea?

Speaker: Dr. David A. Demer

Senior Scientist and Leader, Advanced Survey Technologies Program

National Oceanic and Atmospheric Administration

8901 La Jolla Shores Drive

La Jolla, CA, 92037

Abstract

Most people are consuming more fish and are paying more for it. Less of it is wild caught and more is from aquaculture. Wild fish populations depend on ecosystem productivity, which is effected by a variety of forces such as El Niño, the Pacific Decadal Oscillation, climate change, ocean acidification, pollution, and fishing. These factors can change fish distributions, damage habitats, and alter biodiversity and ecological functions. In this context, we will explore the living resources in two of the most productive ecosystems on Earth:  the Scotia Sea in the Southern Ocean, off the Antarctic Peninsula; and the California Current off the west coast of North America. We will learn how a variety of optical and acoustic instruments, and manned and autonomous vehicles are used to probe these remote and often inaccessible regions. In the process of counting and mapping exploited fish, we will touch on the complex interactions of climate, weather, seabed and oceanographic environments, avian and marine prey and predators, and fishers. We may enhance our appreciation for the effect the world ocean has on humanity, and vice-versa.

(more…)

IEEE Phoenix Section Student Scholarships For The Year 2015

Friday, October 9th, 2015

ieee_logo_mb_tagline
The IEEE Phoenix Section awards Student Scholarships to full-time graduate and undergraduate students who are IEEE student members. The applying student must attend a university in the Phoenix Section during 2015. The universities include Arizona State University, Arizona State University Polytechnic, DeVry University, Embry-Riddle Aeronautical University, and Northern Arizona University.

The student should submit a completely filled application along with financial aid statement; a one-page personal statement of achievements, interests, and goals; official transcripts of all college work; and recommendation letters. The scholarships are awarded based on academic achievement, financial need, and service to the IEEE.
(more…)

October 2015 Issue of Valley Megaphone

Thursday, October 8th, 2015

The October 2015 edition of the IEEE Phoenix Section newsletter “Valley  Megaphone” is now available.  The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.

IEEE Member-Get-a-Member (MGM) Program

Tuesday, September 29th, 2015

September 2015 Issue of Valley Megaphone

Friday, September 18th, 2015

The September 2015 edition of the IEEE Phoenix Section newsletter “Valley  Megaphone” is now available.  The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older  editions of the Megaphone can always be found here.