IEEE Phoenix Section

Including Northern Arizona


IEEE Components, Packaging and Manufacturing Technology Society

Phoenix Chapter

Wednesday, November 18th, 2015 at 5:30 PM

Film Assisted Molding: An Enabling Technology for Encapsulation of Advanced Packages

John Crane

JH Crane & Associates

Scottsdale, AZ 85266 USA


The use of film in the transfer molding process, called Film Assist Molding (FAM), enables repeatable and high volume packaging for surfaces that must be kept free of mold compound, such as for Sensor/MEMS applications. Moreover, this encapsulation technology has provided the pathway for ever-increasing complex packages that are smaller and thinner, while compatible with superior mold compounds to meet the most stringent, cost effective customer device and package performance requirements. This presentation will introduce FAM, explore the possibilities and benefits of FAM to semiconductor encapsulation and explore implemented FAM solutions showing that it is possible to economically manufacture advanced packages of Sensors and MEMS in high volume production while achieving high device reliability.

Date:             Wednesday, November 18th, 2015

Location:       Group Conference Room, Freescale Semiconductor, Inc., Discovery Business Center, 2100 E. Elliot Rd. Tempe, AZ. Enter the facility through the Main (South) Lobby in building 94 and sign in with Security (Photo ID required) BEFORE 6:00 PM. You will be escorted to the meeting room. The presentation promptly starts at 6:00 PM.

Agenda:        5:30–6:00 PM: Social/Refreshments, 6:00–7:00 PM: Presentation, 7:00 PM: Dinner

(Pizza and Soda will be provided by the IEEE Phoenix Section CPMT Society Chapter)

IEEE members and non-members are all welcome to attend. Please arrive at the facility entrance no later than 5:45 PM.

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