The June 2016 edition of the IEEE Phoenix Section newsletter “Valley Megaphone” is now available. The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.
Archive for June, 2016
Understanding the Optical, Thermal, and Electrical Performances of LED and their Relationship to Efficiency of Solid-State Lighting
Prof. Shi-Wei Ricky Lee, FIEEE, FASME, FIMAPS, FInstP
Professor of Mechanical & Aerospace Engineering, HKUST
Director of Center for Advanced Microsystems Packaging
Director of HKUST LED-FPD Technology R&D Center at Foshan
Senior Past-President of IEEE Components, Packaging and Manufacturing Technology Society
WYSIWYG (what you see is what you get) is an acronym in computer engineering to indicate the technology for matching the edited documents viewed on the monitor screen and its hardcopies in a printed format. In this presentation, I would like to illustrate a similar concept in LED packaging for solid-state lighting (SSL). LED has been claimed as the 4th generation light source which has the major merits of rather low power consumption and very long service life. Typical specifications include 150 lm/W and 50000 hours for luminous efficacy and operating life, respectively. However, it appears that not all people understand what these specifications refer to and imply. As a result, inappropriate expectation may occur due to misperception. In other words, what you see may not be what you thought. Consequently, such misunderstanding may hinder the propagation of LED for SSL. In this presentation, the essence in LED packaging to achieve WYSIWYT (what you see is what you thought) for SSL will be reviewed. Various topics on efficiencies and their corresponding loss channels at the LED package and luminaire levels will be discussed. Emphasis will be placed on the trends of LED packaging in order to achieve the intended performance.
Ricky Lee received his PhD degree from Purdue University in 1992. He joined the Hong Kong University of Science & Technology (HKUST) in 1993. During his career of tenure-track faculty at HKUST, Dr Lee once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute (NAMI) for two and a half years. Currently Dr Lee is Professor of Mechanical Engineering and Director of Center for Advanced Microsystems Packaging (CAMP) at HKUST. He also has a concurrent appointment as Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong, China. Due to his technical contributions, Dr Lee received many honors and awards over the years. In addition to being the recipient of 12 best/outstanding paper awards and 5 major professional society awards, Dr Lee is Life Fellow of ASME and IMAPS, and Fellow of IEEE and Institute of Physics (UK). He is also a Distinguished Lecturer and the Senior Past-President of the IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society.
Date: Monday, June 6th, 2016
Location: Constellation Room, NXP Semiconductors, Discovery Business Center, 2108 E. Elliot Rd. Tempe, AZ.
Note New Address – Park on east side of campus – New main entrance on south side facing Elliot.
Sign in at the security station to obtain visitor pass (Photo ID required) BEFORE 6:00 PM
You will be escorted to the meeting room. Please arrive at the entrance no later than 5:45 PM.
Agenda: 5:30–6:00 PM: Social/Refreshments, 6:00–7:00 PM: Presentation, 7:00 PM: Dinner
The presentation promptly starts at 6:00 PM.
(Pizza and Soda will be provided by the IEEE Phoenix Section CPMT Society Chapter)
IEEE members and non-members are all welcome to attend.