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Archive for September, 2016

SusTech Poster Contest 2016 – Deadline Extended

Thursday, September 15th, 2016

SusTech 2016 invites undergraduate students to submit abstracts for the Student Poster Contest.

Students are invited to send in ideas or designs for developing projects/products supporting the sustainability topics areas of the Conference. The selected posters will be displayed during the SusTech 2016 Student Poster Session, on Sunday October 9, being held in Phoenix, Arizona, USA.

The deadline to submit poster abstractscall-for-abstracts-poster-sustech-2016 is midnight US Mountain Time, September 23,2016.

Notification of acceptance will be sent out within two days of submission.


Poster authors must be undergraduate or graduate students at the time of submission and may be members of a team comprising of up to four students. At least one student author must be an IEEE student member at the time of the submission of the poster to the Contest. The poster should be fully the work of the student or students and completed before they have received their respective engineering or scientific degree.


  • Internet of Things – IOT (e.g.: Sensors, computing, control, communication, storage and drive electronics targeted for IOT applications, medical electronics, drones)
  • Smart Grid (e.g. communication, control, power electronics, energy storage, demand control and response)
  • Waste: (e.g. reduction, conversion, disposal, recycling, reuse, harvesting, managing product lifecycle)
  • Renewable Energy (e.g. solar, wind, tidal, fuel cells, energy harvesting, nuclear, thermal, power distribution)
  • Water (e.g. Sourcing & distribution, conservation, harvesting, waste disposal, recycling)
  • Electronics (e.g. components and systems, sustainable manufacturing, automotive and industrial applications)
  • Energy Efficiency (e.g. sensing and measurement, energy saving, auto electrification & fuel economy, data centers)
  • Transportation (e.g. electric & autonomous vehicles, aviation, motors, drive controls, batteries)
  • Societal Implications / Quality of Life (e.g. global warming, sustainability education, human resources, risk-management, remediation, public policy)


To participate in the contest students should write a 2-page (500-700-word) description (abstract) of the poster, along with authors names, respective university and contact details; and submit it using the SusTech website (include hyperlink here once weblink is created) by the specified deadline. The abstracts will be reviewed and authors notified by Sept 20th if they will be presenting at SusTech. If you have any questions or problems submitting your abstract, please contact session chairs Dr. Phani Vallabhajosyula, and Prof Michael Goryll at and Contestants will need to prepare a poster of no larger than 48 x 36 inches and on a tri-fold board.


Key Dates Sept. 23, 2016 Submission deadline for poster abstract
Abstract Submission date + 2days Notification of Acceptance
Oct. 9, 2016 Final Poster Display During Conference


Cash prizes will be awarded for first, second and third places as determined by the judges. First place $750; second $500; third $250. Information on the winners will be posted on the SusTech and IEEE Region 6 websites.


  1. Poster authors must be undergraduate or graduate students at the time of submission and may be members of a team comprising of up to four students.
  2. At least one student author must be an IEEE student member at the time of the submission of the poster to the Contest.
  3. The poster should be fully the work of the student or students and completed before they have received their engineering or scientific degree.
  4. The poster abstract should not be previously published or presented at another conference which has assigned copyright. If any plagiarism or copyright issues are found for the abstract, it will not be accepted.
  5. Poster abstracts must be submitted by the deadline. Abstracts submitted afterward will not be considered for evaluation.
  6. The organizing/review committee of the SusTech 2016 Student Poster Contest reserves the right to accept or reject any abstract without assigning any reason.


  1. Posters must be tri-fold and may be no larger than 36”x48”
  2. Posters will be placed to stand alone on the tables


  1. Set up begins at 2:30 pm. At least one of the authoring students must be present at the SusTech Conference.
  2. Poster boards will be numbered.  Presenters should attach their posters to the board number corresponding to the number assigned to their poster.
  3. Judging will occur from 5:30-6:00pm.
  4. Poster session is open 3:00 pm – 7:00 pm.
  5. Take down by presenters no later than 7:10 pm.  Posters not removed by 7:10 pm will be taken to the Registration area.
  6. If selected as one of the winning posters, you will receive a ribbon on your poster and will also be notified via email.
  7. The SusTech Conference may request that prize posters be held temporarily for public display.

September 2016 Issue of Valley Megaphone

Wednesday, September 14th, 2016

The September 2016 edition of the IEEE Phoenix Section newsletter “Valley  Megaphone” is now available.  The issue includes all the information regarding IEEE-Phoenix Section and its Society Chapters. Download the PDF version from the link right here. The current and older editions of the Megaphone can always be found here.

IEEE-CPMT Society, Phoenix Chapter Meeting, September 20, 2016

Thursday, September 8th, 2016

Tuesday, September 20th, 2016 at 5:30 PM

 On-Chip Embedded Cooling of Power and Logic Components

 Avram Bar-Cohen*, PhD – IEEE/CPMT Distinguished Lecturer

Principal Engineering Fellow, Raytheon Corporation – Sape & Airborne Systems, Rosslyn, Virginia,

(*on Leave fromUniversity of Maryland, College Park, Maryland, USA)


Thermal packaging technology has been a key enabler in the development of today’s microelectronic systems, including smart phones, tablet computers, back-room data-crunching supercomputers, and the navigation systems that have come to define our lives in the 21st Century. Much of the benefit that we derive from miniaturization, higher performance, lower cost and greater reliability of these quintessential 21st Century “widgets,” can be traced to improvements in thermal technology, thermal modeling, and the integration of thermal management principles and techniques into electronic product development.

A review of thermal packaging over the first 70 years of the Information Age will reveal a relentless “inward migration” of cooling technology from room ventilation and air-conditioning, to cabinet cooling, to component cooling with heat sinks and cold plates, and to today’s efforts to address on-chip hot spots and near-junction thermal transport. Attention will then be devoted to current thermal management requirements, driven by nano-electronics, which confront packaging engineers with the simultaneous “triple threat” of high-power, “hotspots,” and 3D integration in applications as diverse as high performance computing, power electronics, and RF systems. The lecture will close with a review of 3rd-generation thermal management technologies relying on intra- and interchip microfluidic cooling, use of diamond substrates, and on-chip thermoelectric coolers to implement the emerging “embedded cooling” paradigm. 

Date:           Tuesday, September 20th, 2016

Location:    Constellation Room, NXP Semiconductors, Discovery Business Center, 2108 E. Elliot Road, Tempe, Arizona..

Note New Address – Park on east side of campus – New main entrance on south side facing Elliot Road

Sign in at the security station to obtain visitor pass BEFORE 5:45 PM. Present Valid Photo ID.

You will be escorted to the meeting room. Within the building you should always be escorted..

Agenda:     5:30–6:00 PM: Social/Refreshments, 6:00–7:00 PM: Presentation, 7:00 PM: Dinner

(Pizza and Soda will be provided by the IEEE Phoenix Section CPMT Society Chapter)

IEEE members and non-members are all welcome to attend. The presentation promptly starts at 6:00 PM.