IEEE Phoenix Section

Including Northern Arizona

IEEE

IEEE-CPMT Society, Phoenix Chapter Meeting, September 20, 2016

Tuesday, September 20th, 2016 at 5:30 PM

 On-Chip Embedded Cooling of Power and Logic Components

 Avram Bar-Cohen*, PhD – IEEE/CPMT Distinguished Lecturer

Principal Engineering Fellow, Raytheon Corporation – Sape & Airborne Systems, Rosslyn, Virginia,

abc@umd.edu

(*on Leave fromUniversity of Maryland, College Park, Maryland, USA)

 ABSTRACTieee-phoenix-section-cpmt-society-chapter-september-20

Thermal packaging technology has been a key enabler in the development of today’s microelectronic systems, including smart phones, tablet computers, back-room data-crunching supercomputers, and the navigation systems that have come to define our lives in the 21st Century. Much of the benefit that we derive from miniaturization, higher performance, lower cost and greater reliability of these quintessential 21st Century “widgets,” can be traced to improvements in thermal technology, thermal modeling, and the integration of thermal management principles and techniques into electronic product development.

A review of thermal packaging over the first 70 years of the Information Age will reveal a relentless “inward migration” of cooling technology from room ventilation and air-conditioning, to cabinet cooling, to component cooling with heat sinks and cold plates, and to today’s efforts to address on-chip hot spots and near-junction thermal transport. Attention will then be devoted to current thermal management requirements, driven by nano-electronics, which confront packaging engineers with the simultaneous “triple threat” of high-power, “hotspots,” and 3D integration in applications as diverse as high performance computing, power electronics, and RF systems. The lecture will close with a review of 3rd-generation thermal management technologies relying on intra- and interchip microfluidic cooling, use of diamond substrates, and on-chip thermoelectric coolers to implement the emerging “embedded cooling” paradigm. 

Date:           Tuesday, September 20th, 2016

Location:    Constellation Room, NXP Semiconductors, Discovery Business Center, 2108 E. Elliot Road, Tempe, Arizona..

Note New Address – Park on east side of campus – New main entrance on south side facing Elliot Road

Sign in at the security station to obtain visitor pass BEFORE 5:45 PM. Present Valid Photo ID.

You will be escorted to the meeting room. Within the building you should always be escorted..

Agenda:     5:30–6:00 PM: Social/Refreshments, 6:00–7:00 PM: Presentation, 7:00 PM: Dinner

(Pizza and Soda will be provided by the IEEE Phoenix Section CPMT Society Chapter)

IEEE members and non-members are all welcome to attend. The presentation promptly starts at 6:00 PM.

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