IEEE Phoenix Section

Including Northern Arizona

IEEE

Archive for September, 2017

Poster Session for SusTech 2017, Nov. 12, 2017

Thursday, September 21st, 2017

SusTech 2017 Student Poster Contest – Abstract Submission Dead line extended to Sept. 28, 2017

 

1st Price – $750

2nd Price – $500

3rd Price – $250

For more information, abstract upload, and registration, please visit

http://sites.ieee.org/sustech/ or see attached flyer or

Please contact: Poster Contest Chairs:

Dr. PhaniVallabhajosyulaphani.c.v@ieee.org; +1-512-797-835

Student Poster Contest

Student Poster Contest

 

IEEE Electronics Packaging Society (EPS) – Phoenix Chapter, Sept. 27, 2017

Friday, September 15th, 2017

IEEE Electronics Packaging Society (EPS) – Phoenix Chapter

Formerly Known as Components, Packaging and Manufacturing Technology (CPMT) Society

Wednesday, September 27, 2017: 5:30 PM

PLEASE NOTE CHANGE OF LOCATION TO TEMPE PUBLIC LIBRARY

Advancements in High Density Fan-out and Heterogeneous Integration

by Curtis Zwenger, VP, Advance Package & Technology Integration, Amkor Technology, Inc.

Curtis.Zwenger@amkor.com

ABSTRACT

An advanced high-density fan-out structure called Silicon Wafer Integrated Fan-out Technology (SWIFT®) incorporates conventional WLFO processes with leading-edge thin film patterning techniques to bridge the gap between TSV and traditional WLFO packages. The SWIFT methodology is designed to provide increased I/O and circuit density within a reduced footprint and profile for single and multi-die applications.  The unique characteristics of the SWIFT process enable the creation of innovative structures that address the need for IC integration in emerging mobile and networking applications.  This presentation will review the development of the SWIFT technology and its extension into high performance 2D and 3D structures.  In addition, the advantages of SWIFT designs will be reviewed in comparison to current competing packaging technologies and to illustrate how the SWIFT is poised to provide robust, reliable, and low-cost packaging solutions for advanced mobile and networking products.

SWIFT is a registered trademark of Amkor Technology, Inc.

BIOGRAPHY

Curtis Zwenger, VP Adv. Package & Technology Integration    Amkor Technology

Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via, and MEMS packaging technologies. He is currently responsible for the development and commercialization of Amkor’s Advanced Wafer Level Fan-Out package technologies, including WLFO and SWIFT®.  Prior to joining Amkor, Curtis worked for Motorola. He holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.

 

IEEE Electronics Packaging Society (EPS) – Phoenix Chapter, Sept. 20, 2017

Friday, September 15th, 2017

 

IEEE Electronics Packaging Society (EPS) – Phoenix Chapter,

(Formerly Known as CPMT Society)

Wednesday, September 20, 2017: 5:30 PM

At TEMPE PUBLIC LIBRARY

Innovation Roadmapping: Proven process to deliver Innovation to market

Yani Deros, President & Co-founder

ATOM Innovation + Product Development

yderos@atom-inc.co

www.atom-inc.co

ABSTRACT

Delivering the right innovation to any market is no small task in today’s fast paced and connected world. Expectations are high and everyone has a voice and opinion that can be the difference between a product success or failure. Find out how ATOM, a full-service product innovation firm based in Scottsdale, transforms the unique challenges each seed idea/concept through a comprehensive development methodology utilizing their proven Roadmapping process. Understand the formula and critical dynamics of validating the real problems needing to be solved. Tap into the “Voice of the Consumer/Customer” harvesting key insights to establish the product requirements and specifications to define the product development plan. Embrace iterative prototyping (hardware/electronics/UI) and user testing to optimize the user experience as an insurance policy often overlooked to mitigate unnecessary production delays, re-tooling, overruns and failures that adversely derail corporate objectives. Ultimately realize how the encompassing orchestration of shaping technology, electronics, product design and usability is skillfully applied to a Design for Manufacturing solution that can deliver on the expectations – market launch and bottom line revenue!

BIOGRAPHY

Yani Deros is an Innovation leader and visionary with 26+ years of experience developing advanced product and technology solutions for start-ups to global corporations. Yani has built ATOM into an internationally recognized and acclaimed product innovation firm specializing in the commercialization of emerging technologies and markets with a majority of their programs including electronics integration.

He has been the nucleus of many extraordinary development programs for some of the largest brands in the world providing creative leadership and a sound development philosophy that has delivered first-to-market and disruptive solutions across a wide range of industries.

ATOM has become one of the most proficient innovation firms in the country having developed over 280+ products and technology solutions in the last 14+ years that have resulted in almost $3B in durable goods orders over that timeframe.

Additionally, Yani has played an instrumental role in helping companies raise over $125 million in venture capital related to his technical and development contributions. His creativity has been honored by many of the most prestigious international product awards in addition to the 65+ U.S. and International patents received to date.