IEEE – CPMT Society, Phoenix Chapter, March 1, 2017

IEEE_PHXSect_CPMTSociety_030117 Wednesday, March 1, 2017: 5:30 PM PLEASE NOTE CHANGE OF LOCATION TO TEMPE PUBLIC LIBRARY Design Challenges of Portable RF Cooking & Other Consumer Microwave Application Mr. David Lester, Technical Marketing NXP Semiconductor Chandler, AZ, USA  +1-480-814-4461, david.lester@nxp.com ABSTRACT Recent advances in solid state power generation technology have enabled the design of a portable “microwave” oven.  This… Read more

Annual Banquet Registration Deadline Extended to 7th February

Annual Banquet – Saturday, February 11th, 2017 Phoenix Airport Marriott, 1101 North 44th Street, Phoenix, Arizona 85008 Keynote Presentation  Title: The Strategic Landscape for Healthcare: Balancing Technological Innovation and the Cost of Care  Speaker: Dr. George Poste Chief Scientist of Complex Adaptive Systems Initiative (CASI) Regents Professor and Del E. Webb Chair in Health Innovation… Read more

IEEE Phoenix Section Student Scholarships For The Year 2016

Please Submit the Scholarship Application at the Link below: IEEE Phoenix Section Student Scholarships For The Year 2016 ******************************************************************** The IEEE Phoenix Section awards Student Scholarships to full-time graduate and undergraduate students who are IEEE student members. The applying student must attend a full academic year at a university in the Phoenix Section during 2016. The universities… Read more

IEEE Phoenix Section Awards For The Year 2016

Please Submit the Nomination Form at the link below: IEEE Phoenix Section Awards For The Year 2016 ************************************************************************* The IEEE Phoenix Section recognizes the contributions of members, non-members, society chapters, affinity groups, student branches, corporations, and educational institutions at the annual banquet. The next banquet is scheduled for Saturday, February 11th, 2017 at Phoenix Airport… Read more

IEEE CPMT Society Meeting, Wednesday, November 16 2016

ieee-phoenix-section-cpmt-society-chapter-november-16-2016-meeting-prof-muhannad-s-bakir2.5D and 3D IC Technology for Electronic Microsystems: Design Considerations and Experimental Demonstrations Dr. Muhannad S. Bakir Professor, School of Electrical & Computer Engineering, Georgia Institute of Technology ABSTRACT http://sites.ieee.org/phoenix/files/2016/11/IEEE-Phoenix-Section-CPMT-Society-Chapter-November-16-2016-Meeting-Prof.-Muhannad-S.-Bakir.pdf This presentation will address innovative interconnection and integration technologies for electronic microsystems. First, we discuss a highly scaled through-silicon via (TSV) technology for fine-grain heterogeneous… Read more

SusTech Poster Contest 2016 – Deadline Extended

SusTech 2016 invites undergraduate students to submit abstracts for the Student Poster Contest. Students are invited to send in ideas or designs for developing projects/products supporting the sustainability topics areas of the Conference. The selected posters will be displayed during the SusTech 2016 Student Poster Session, on Sunday October 9, being held in Phoenix, Arizona,… Read more

IEEE-CPMT Society, Phoenix Chapter Meeting, September 20, 2016

Tuesday, September 20th, 2016 at 5:30 PM  On-Chip Embedded Cooling of Power and Logic Components  Avram Bar-Cohen*, PhD – IEEE/CPMT Distinguished Lecturer Principal Engineering Fellow, Raytheon Corporation – Sape & Airborne Systems, Rosslyn, Virginia, abc@umd.edu (*on Leave fromUniversity of Maryland, College Park, Maryland, USA)  ABSTRACTieee-phoenix-section-cpmt-society-chapter-september-20 Thermal packaging technology has been a key enabler in the… Read more

IEEE-CPMT Society, Phoenix Chapter Meeting, August 17, 2016

IEEE Phoenix Section CPMT Society Chapter – August 17, 2016 Meeting – Dr. Katsuyuki Sakuma  Dr. Katsuyuki Sakuma Research Staff Member, IBM T.J. Watson Research Center ABSTRACT 3D IC integration technology and large die packaging are essential ingredients for further performance enhancement of main frame and super-computer applications, but warpage of large and thin interposers… Read more

IEEE-CPMT Society Phoenix Chapter Meeting on Monday June 6, 2016

Understanding the Optical, Thermal, and Electrical Performances of LED and their Relationship to Efficiency of Solid-State Lighting  Prof. Shi-Wei Ricky Lee, FIEEE, FASME, FIMAPS, FInstP Professor of Mechanical & Aerospace Engineering, HKUST Director of Center for Advanced Microsystems Packaging Director of HKUST LED-FPD Technology R&D Center at Foshan Senior Past-President of IEEE Components, Packaging and… Read more