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Creating Reliable and Manufacturable RF Designs

September 13, 2017 @ 5:30 pm - 8:00 pm

Electronic system demands for smaller size, lighter weight, lower power consumption and lower cost (also known as SWAP-C) are being met through design, development and production of heterogeneous high density packages, system in package (SIP), and system on chip (SOC).   Complex monolithic chips containing high number of semiconductor devices present unique challenges when it comes to determining reliability. 

Reliability is designed in by taking numerous device physics properties into account.  Many of the effects such as activation energy, electro migration, hot carrier injection, dissimilar metals and whisker growth need to be taken in consideration when designing RF systems and for that matter any other electronic systems.  The production considerations incorporate overall the best value, manufacturability, quality, parts obsolescence, supply chain and support through the life of the systems. These issues will be covered and show that implementing these measures leads to overall value, higher reliability and a lower total cost ownership.

Speaker(s): Chandra Gupta, Ph.D., MBA,


This meeting will be held on Wednesday, September 13, 2017 at 3 Forbes Road, Lexington, MA.

5:30-6:00 PM: Sign in, refreshments, and personal networking

6:00-6:10 PM: Chapter Chair greetings and announcements

6:10-7:45 PM: Presentation, Chandra Gupta, Communications and Power Industries (CPI)

7:45-7:55 PM: Q&A session, meeting adjourns

3 Forbes Rd
Lexington, Massachusetts


September 13, 2017
5:30 pm - 8:00 pm

IEEE Region 1 Website