Package Requirements for High-Speed Systems

IEEE SCV CAS is proudly co-sponsoring IEEE/CPMT Lunch Meeting, in the Santa Clara Valley:

    Package Requirements for High-Speed Systems
— Dr. Wendem T. Beyene, Rambus Inc.

Tuesday, May 10, 2016

  • Optional lunch provided ($10 for non-members, $5 for IEEE members/students/unemployed)
  • Registration (and sandwiches/drinks) at 11:30 AM
  • Presentation-only (no cost) at 12:00 PM noon (come at 11:45 AM)
  • Please reserve by the end of May 8, so we can provide the food.
  • We welcome those looking for employment to bring copies of your resume with you. We will have a table set up for you to sit and network with others.

 

Please register in advance for this event, using our CPMT Chapter’s EventBrite registration site.

You may register yourself, plus others from your company/institution, for this lunch and presentation. Please make anon-line payment for the lunch.

LOCATION: Texas Instruments Building E Conference Center
2900 Semiconductor Dr. (off Kifer Rd), Santa Clara — click map at right.

OVERVIEW:
    As data rates increase rapidly in high speed systems — such as in SerDes and memory systems — to meet the bandwidth growth required by various applications, the electrical performance of packages has become critical. In addition, the role of new emerging 2.5D and 3D IC packaging platforms with ever-increasing system integration requirements have made the role of packaging even more important. The sources of signal loss, noise coupling and discontinuities in packages must be fully understood and minimized when designing packages. At the same time, the design and development of packages have to meet cost, performance, form factor and reliability goals. In this talk we will examine the key electrical characteristics: signal loss, signal crosstalk, return loss, mode conversion, power integrity and other important factors affecting the bandwidth of high-speed systems. These key performance metrics are discussed using measurement results from various package designs.

Speaker Biography:
    Wendem T. Beyene received his B.S. and M.S. degrees in Electrical Engineering from Columbia University, in 1988 and 1991 respectively, and his Ph.D. degree in Electrical and Computer Engineering from University of Illinois at Urbana-Champaign, in 1997. In the past, he was employed by IBM, Hewlett-Packard, and Agilent Technologies. He is currently a technical director at Rambus Inc. where he is responsible for signal and power integrity of multi-gigabit serial and parallel interfaces.

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