Santa Clara Valley-San Francisco Chapter of Electron Devices Society

IEEE
Past Events

Past Events

2017 Past Events

 

***************************************************************************************

November:

IEEE SCV-SF Electron Devices Society Seminar “From Molecules to Pavlov’s Dog: Using Conjugated Polymers to Make Artificial Synapses”

Speaker: Dr. Prof. Alberto Salleo, Stanford University, USA

Date: Tuesday, November 14th, 2017

Contact: Vijay Narasimhan 

Abstract:

The brain can perform massively parallel information processing while consuming only
~1- 100 fJ per synaptic event. Two-terminal memristors based on filament forming metal
oxides (FFMOs) or phase change memory (PCM) materials have recently been
demonstrated to function as non-volatile memory that can emulate neuronal and synaptic
functions. Despite recent progress in the fabrication of device arrays however, to date no
architecture has been shown to operate with the projected energy efficiency while
maintaining high accuracy. A major impediment still exists at the device level,
specifically, a resistive memory device has not yet been demonstrated with adequate
electrical characteristics to fully realize the efficiency and performance gains of a neural
architecture. I will describe a novel electrochemical neuromorphic device (ENODe) that
switches at record-low energy (<0.1 fJ projected, <10 pJ measured) and voltage (< 1mV,
measured), displays >500 distinct, non-volatile conductance states within a ~1 V
operating range, and achieves record classification accuracy when implemented in neural
network simulations. We recently showed that combined with a Si access device we are
able to achieve over 106 switching events with very little degradation. Our organic
neuromorphic device works by combining ionic (protonic) and electronic conduction and
is essentially similar to a concentration battery. The main advantage of this device is that
the barrier for state retention is decoupled from the barrier for changing states, allowing
for the extremely low switching voltages while maintaining non-volatility. Finally, plastic
ENODEs can be entirely fabricated on flexible substrates unlocking new opportunities
for integrating neuromorphic functionality in flexible and stretchable large-area
electronic systems, such as “smart skins”, that mimic the adaptive properties of biological
organs.

Biography:

Alberto Salleo is currently an Associate Professor of Materials Science at Stanford
University. Alberto Salleo graduated as a Fulbright Fellow with a PhD in Materials
Science from UC Berkeley in 2001. From 2001 to 2005 Salleo was first post-doctoral
research fellow and successively member of research staff at Xerox Palo Alto Research
Center. In 2005 Salleo joined the Materials Science and Engineering Department at
Stanford as an Assistant Professor and was promoted to Associate Professor in 2013.
Salleo is a Principal Editor of MRS Communications since 2011. He has published over
170 peer-reviewed articles, co-authored 8 book chapters and co-edited a book on flexible
electronics. In 2015 and 2016 he was a Thomson Reuters Highly Cited Researcher in
Materials Science (top 1% citations in the field).
While at Stanford, Salleo won the NSF Career Award, the 3M Untenured Faculty Award,
the SPIE Early Career Award and the Tau Beta Pi Excellence in Undergraduate Teaching
Award and the Gores Award for Excellence in Teaching, Stanford’s highest teaching
honor.

****************************************************************************************

October:

IEEE SCV-SF Electron Devices Society Seminar “Reliability challenges for the qualification of Leading Edge CMOS Technologies”

 

Speaker: Dr. Fernando Guarín, IEEE Fellow, Distinguished Member of technical Staff, GlobalFoundries East Fishkill, NY. USA

 

Date: Tuesday, October 10th, 2017

Contact: Victor Cao

Abstract:
This presentation will address some of the key reliability challenges during the qualification of leading edge CMOS technologies. Some of the issues are driven by self heating in SOI and some by the latest trends in semiconductor fabrication as we continue to scale and deal with the new reliability challenges introduced by the use of High K Metal Gate (HKMG) and FinFet devices. We will discuss the reliability impact and the qualification activities driven by the introduction of SOI and new materials. The path to maintaining the advanced CMOS scaling cadence and new reliability limiting factors will be examined from the reliability perspective. A closer look will be given to Hot Carriers, Bias Temperature Instabilities and Gate Dielectric Integrity. The characterization, models and qualification methodologies will be put in the required perspective for the successful qualification and transfer of leading edge technologies to a manufacturing environment.

Biography:
Dr. Fernando Guarín is a Distinguished Member of Technical Staff at Global Foundries in East Fishkill NY. He retired from IBM’s Semiconductor Research Development Center after 27 years as Senior Member of Technical Staff. He earned his BSEE from the “Pontificia Universidad Javeriana”, in Bogotá, Colombia, the M.S.E.E. degree from the University of Arizona, and the Ph.D. in Electrical Engineering from Columbia University, NY He has been actively working in microelectronic reliability for over 35 years. From 1980 until 1988 he worked in the Military and Aerospace Operations division of National Semiconductor Corporation. In 1988 he joined IBM’s microelectronics division where he worked in the reliability physics and modeling of Advanced Bipolar, CMOS and Silicon Germanium BiCMOS technologies. Dr. Guarín is an IEEE Fellow, Distinguished Lecturer for the IEEE Electron Device Society, where he has served in many capacities including; member of the IEEE’s EDS Board of governors, chair of the EDS Education Committee, Secretary for EDS. He is the EDS President-Elect 2016-2017.

 

Aug 8th, 2017 Recent Progress in Memory Technology Reliability

Speaker: Dr. Bob Gleixner, Micron Technology Inc.

Link to slides

July 11th, 2017 System Level ESD: A New Focus

Speaker: Dr. Charvaka Duvvury, ESD Consulting

Link to slides

June 13th, 2017 Device and Process Variability

Speaker: Dr. Tomasz Brozek, Technical Fellow and Engagement Director at PDF Solutions, San Jose, CA

Link to slides

May 9th, 2017 New Visions for IC Yield Detractor Detection

Speaker: Bill Nehrer, VP and Account General Manager, PDF Solutions, San Jose, CA

March 14th, 2017 Progress Toward Wafer-Scale Thermionic Energy Converters

Speaker: Prof. Roger Howe, Dept. of Electrical Engineering, Stanford Nano Fabrication Facility, Stanford University

2016 Past Events

Dec 1st, 2016 On-Chip ESD Protection Design: Yesterday, Today, Tomorrow and Future

Speaker: Prof. Albert Wang, University of California, Riverside

Nov 11th, 2016  IEEE SCV-SF EDS Annual Symposium Device Circuit Interaction in Advanced Technology Nodes
Oct 11th, 2016 Time-Zero and Time-Dependent Variability in Advanced CMOS

Speaker: Dr. Jeffrey T. Watt, Intel Fellow, Intel Corp. 

Lecture slides

Sept 30th, 2016 Mini-colloquium Emerging Devices, Materials and Technologies

Speaker(s): Leading scientists and engineers, including EDS Distinguished Lecturers

Aug 9th, 2016 Circuit Device Interactions and co-optimizations, from system and chip design to process integration – The secret sauce for complex SOC chips and SIPs in advanced technology nodes

Speaker: Dr. John Hu, Director of Advanced Technology, Nvidia Corp., Santa Clara, CA

July 12th, 2016 Electronics and Energy Applications of 1D and 2D Nanomaterials

Speaker: Dr. Eric Pop, Associate Professor of Electrical Engineering , Stanford University, Stanford CA

Lecture slides

May 10th, 2016 Designing with FinFETs

Speaker: Dr. Witold (Witek) P. Maszara, GLOBALFOUNDRIES, Santa Clara, CA

June 14th, 2016 High Frequency Characterization of Transistors

Speaker: Dr. Jayasimha Prasad, Device/Process Integration Engineer, Foveon Inc, San Jose CA

Lecture slides

Apr. 12th, 2016 Learnings and insights from 52 years of Silicon Valley semiconductor experience

Speaker: Ray Zinn, Founder and CEO of Micrel, San Jose, CA

Video recording of presentation

Mar. 8, 2016 Technology CAD from Electronics to Bioelectronics

Speaker: Dr. Yang Liu, Professor at the College of Information Science and Electronic Engineering, Zhejiang University, China

 

Feb. 9, 2016 Everything You Wish to Know about Memristors But Are Afraid to Ask

Speaker: Dr. Leon Chua, Professor of EECS, University of California, Berkeley

Lecture links

2015 Past Events

May. 19, 2015 Nanoscale Vacuum Electronics

Speaker: Dr. Meyya Meyyappan, Chief Scientist for Exploration Technology at NASA Ames Research Center in Moffett Field, CA 

 

Feb. 10, 2015 A photovoltaic diode array as a retinal prosthesis for patients with degenerative retinal diseases

Speaker: Dr.Theodore I. (Ted) Kamins, Stanford University   IEEE SCV Electron Devices SocietyIEEE Photonics Society co-sponsoredAbstract/bio  Slides

2014 Past Events

August 12, 2014 Graphene and Beyond-Graphene 2D Crystals for Next-Generation Green Electronics

Speaker: Dr. Kaustav Banerjee, University of California, Santa BarbaraIEEE SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Time: 6 PM – Pizza, 6:15 PM – talk
Abstract/bio  Directions

July 29, 2014 Mesoscopic Devices and Their Impact on Product Yield: The Next Technological Challenge  

Speaker: Dr. Renuka P. Jindal, Fellow, IEEE, University of Louisiana at Lafayette, LA, USA  IEEE SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Time: 6 PM – Pizza, 6:15 PM – talk
Abstract/bio  Directions

June 10, 2014 Parallel Revolutions: How Breakthroughs in Electronics and Biology are Converging at the Molecular ScaleSpeaker: Dr. Jim Hollenhorst, Agilent TechnologiesIEEE SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Time: 6 PM – Pizza, 6:15 PM – talk
Abstract/bio  Slides (with video link)
April 15, 2014 System Level On-Chip ESD Protection

Speaker: Dr. Vladislav Vashchenko, Maxim Integrated CorpIEEE SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Time: 6 PM – Pizza, 6:15 PM – talk
Abstract/bio  Slides

March 11, 2014 The Roadmap to Success: 2013 ITRS Update

Speaker: Dr. Paolo Gargini, Chairman of ITRS and IEEE/IEC/Intel FellowIEEE SCV Electron Devices SocietyCo-sponsored by SF Bay Area Nanotechnology Council
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Time: 6 PM – Pizza, 6:15 PM – talk
Abstract/bio  Slides

March 5, 2014 Bionic Skins with Ulraflexible Organic Devices

Speaker: Takao Someya, School of Engineering, The University of Tokyo, 3-7-1 Hongo, Bunkyo-ku, Tokyo, JapanStanford University and IEEE SCV Electron Devices Society
Location: the Allen Building room 101X, Stanford UniversityTime: 4:15pm
Abstract/bio

Feb 18, 2014 Product Level Reliability Challenges Originating from TDDB, BTI and Variability

Speaker: Dr. Tanya Nigam, GlobalFoundriesIEEE SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Time: 6 PM – Pizza, 6:15 PM – talk
Abstract/bio  Directions

November 2013
Nov 19, 2013 Eastern Europe’s Semiconductor Technology – Recollections and Projections
Speaker: Dr. C. BuluceaIEEE SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Time: 6 PM – Pizza, 6:15 PM – talk
Abstract/bio  Slides
October 2013
Oct 8, 2013 How far can we push Si CMOS and what are the alternatives for future ULSI
Speaker: Prof. K. Saraswat, Stanford UniversityIEEE SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Time: 6 PM – Pizza, 6:15 PM – talk
Abstract/bio  Slides
September 2013
Sept 24, 2013 Low Power Circuit Design Techniques for Nano-Scale Era
Speaker: Dr. R. V. Joshi, IBMIEEE SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Time: 6 PM – Pizza, 6:15 PM – talk
Abstract/bio
September 2013
Sept 6, 2013 Annual SymposiumPower Electronics: Beyond the Silicon LimitAbstract: Power electronics is re-emerging as an important and innovative area. This is due to the increasing importance of electricity in our lives, and the need to use it more efficiently. … (click to read more)
Speakers:Deva Pattanayak (Senior Director at Vishay Siliconix)Alex Lidow (CEO of EPC)Dave Anderson (Chief Technologist and General Manager of Texas Instruments Kilby Labs Silicon Valley)Johan Strydom (Head of Applications Engineering at EPC)Don Disney (Sr. Director of Technology and Product Development atAvogy)Abstracts/bio
July 2013
Jul 9, 2013 Memristive Devices for Computing
Speaker: Dr. J. Joshua Yang, Hewlett Packard LaboratoriesIEEE SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Time: 6 PM – Pizza, 6:15 PM – talk
Abstract/bio
June 2013
Jun 11, 2013 A Complete NBTI DC / AC Model for SiON and HKMG p-MOSFETs
Speaker: Prof. Souvik Mahapatra, Indian Institute of Technology Bombay, MumbaiIEEE SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Time: 6 PM – Pizza, 6:15 PM – talk
Abstract/bio
April 2013
Apr 9, 2013 High-Efficiency, Flexible, Thin-Film, III-V Solar Cells
Speaker: Dr. Brendan Kayes, Alta DevicesIEEE SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Time: 6 PM – Pizza, 6:15 PM – talk
Abstract/bio
March 2013
Mar 12, 2013 Electronics Applications of Carbon Nanotube and Graphene
Speaker: Prof. H.-S. Philip Wong, Stanford UniversityIEEE SCV Electron Devices Society, co-sponsored by IEEE SFBA Nanotechnology Council
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Time: 6 PM – Pizza, 6:15 PM – talk
Abstract/bio
February 2013
Feb 12, 2013 Towards Storage Class Memory: 3-D crosspoint access devices using Mixed-Ionic-Electronic-Conduction (MIEC)
Speaker: Dr. Geoffrey W. Burr, IBM Almaden Research CenterIEEE SCV Electron Devices Society, co-sponsored by IEEE SFBA Nanotechnology Council
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Abstract/bio Slides
November 2012
November 13, 2012 Analog Technologies: Status & Opportunities
Speaker: Dr. Albert Bergemont, Vice President of Technology, Research & Development, Maxim Integrated Products.IEEE SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Abstract/bio
October 2012
October 9, 2012 Device Considerations for Low Power VLSI Circuits
Speaker: Dr. Robert Rogenmoser, Senior Vice President, Product Development and Engineering, SuVolta, Inc.IEEE SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Abstract/bioPresentation Slides
August 2012
August 14, 2012 Nanoscale CMOS Contacts: Science and Technology
Speaker: Dr. Khaled Ahmed, Applied MaterialsIEEE SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Abstract/bio
June 2012
June 18, 2012 A Unified Compact Model for Generic Heterostructure HEMTs
Speaker: Dr. Xing Zhou, School of Electrical & Electronic EngineeringNanyang Technological University, SingaporeIEEE SCV Electron Devices Society Distinguished Lecture
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Abstract/bioPresentation Slides
May 2012
May 8, 2012 Next Generation Photovoltaics
Speaker: Prof. Sue A. Carter, Physics Department, University of California, Santa CruzIEEE SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.
Abstract/bio
April 2012
April. 10, 2012 2D Carbon/Semiconductor-Enabled Electronics
Speaker: Prof. Bin Yu, College of Nanoscale Science & Engineering, State University of New York – AlbanyIEEE SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.
Abstract/bioPresentation Slides
March 2012
Mar. 20, 2012 FinFET/Trigate FET and Its SPICE Model
Speaker: Professor Chenming Hu, EECS, UC Berkeley, CA, USAIEEE SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Abstract/bioPresentation Slides
February 2012
Feb. 15, 2012 2011 International Technology Roadmap for Semiconductors (ITRS) Update – Overview and Highlights
Speaker: Alan K. Allan, Intel Corporation, Chandler, AZ, USAIEEE SCV Electron Devices Society, co-sponsored by IEEE SFBA Nanotechnology Council
Location: Texas Instruments Building E Conference Center2900 Semiconductor Dr. Santa Clara, CA 95052.Abstract/bioPresentation Slides
November 2011 Half-Day Symposium
Nov. 4, 2011 Current Status and Future Directions of NonVolatile Memory Technology Invited Speakers:Dr. Gurtej Sandhu, MicronDr. Al Fazio, IntelDr. Chuck Dennison, OvonyxProfessor Michael Kozicki, Arizona State UniversityDr. Joshua Yang, HP Laboratories.

IEEE Santa Clara Valley Electron Devices Society
Location: Texas Instruments, Building E1, Conference Center,

2900 Semiconductor Drive, Santa Clara, CA 95051.

Announcement

Speakers’ Biographies

Talk abstract

Agenda

October 2011
Oct. 13, 2011 The Variability Issues in Advanced CMOS: Random Dopant Fluctuation and Random Trap Fluctuation
Speaker: Professor Steve S. Chung, Department of Electronics Engineering, National Chiao Tung University, Taiwan. IEEE Fellow, Distinguished LecturerIEEE SCV Electron Devices Society Distinguished Lecture Program
Location: Kenna 214, Santa Clara University (direction linked below).Abstract/bioPresentation Slides
October 2011
Oct. 11, 2011 Carbon Electronics – From Material Synthesis to Circuit Demonstration
Speaker: Professor H.-S. Philip Wong, Center for Integrated Systems and Department of Electrical Engineering, Stanford UniversityIEEE SCV Electron Devices Society and IEEE SFBA Nanotechnology Council
Location: Texas Instruments
Abstract/bioPresentation Slides
September 2011
Sept. 13, 2011 Metal interconnects for large-area power devices – physics, challenges, and solutions
Speaker: Dr. Maxim Ershov, CTO, Silicon Frontline TechnologiesIEEE SCV Electron Devices Society
Location: National SemiconductorAbstract/bio
August 2011
August 09, 2011 Graphene – Still Heading for Prime Time
Speaker: Prof. Zhiping Yu, Institute of Microelectronics, Tsinghua University, Beijing, ChinaIEEE SCV Electron Devices Society
Location: National Semiconductor.Abstract/bio
Presentation Slides
June 2011
June 14, 2011 Simulation of Statistical Variability and Reliability: From TCAD to Statistical Circuit Simulation
Speaker: Prof. Asen Asenov, FIEEE, FRSE; Leader of the Device Modeling Group, University of Glasgow; CEO of Gold Standard Simulations LtdIEEE SCV Electron Devices Society and IEEE SFBA Nanotechnology Council
Location: National Semiconductor
Abstract/bioPresentation Slides
May 2011
May 10, 2011 Characterization and Modeling of NBTI Stress, Recovery, Material Dependence and AC Degradation Using R-D Framework
Speaker: Professor Souvik Mahapatra, Department of Electrical Engineering, IIT Bombay, IndiaIEEE SCV Electron Devices Society
Location: National Semiconductor
Abstract/bio
Location map and directions
April 2011
April 14, 2011 Future ESD Challenges for IC Components and Systems
Speaker: Dr. Charvaka Duvvury, Texas Instruments (Dallas, USA), EDS Distinguished Lecturer
IEEE SCV Electron Devices Society Distinguished Lecture, cohosted by Stanford IEEE and TCAD group
Location: Stanford University, Paul G. Allen Building Annex, Auditorium 101
Abstract/bio
Presentation Slides
April 2011
April 5, 2011 The History of Flash Memory Technology and What Lies Ahead
Speaker: Ishai Naveh, Adesto Technologies
IEEE SCV Electron Devices Society
Location: National SemiconductorAbstract/bio
March 2011
Mar. 1, 2011 Lithography Options for 22nm and Beyond
Speaker: Dr. Geert Vandenberghe, imec
IEEE SCV Electron Devices Society
Location: National Semiconductor
Abstract/bio
Feb 2011
Feb. 8, 2011 Photovoltaic Module Reliability and Failure Analysis: Enduring a storm
Dr. Glenn Alers, University of California at Santa Cruz
IEEE SCV Electron Devices Society, co-sponsored by IEEE SCV Reliability Society
Location: National Semiconductor
Abstract/bioSpeaker slides
Jan 2011
Jan. 11, 2011 Mechanical Computing Redux: Relays for Integrated Circuit Applications
Prof. Tsu-Jae King Liu, Dept. of EECS, UC Berkeley
IEEE SCV Electron Devices Society
Location: National Semiconductor
Abstract/bio
Dec 2010
Dec. 2, 2010 Millibits to Terrabits per second and Beyond – Over 60 Years of Innovation
Dr. Renuka Jindal, Distinguished Lecture by IEEE Electron Devices Society President
IEEE SCV Electron Devices Society
Location: Santa Clara University
Abstract/bio
Nov 2010
Nov 16, 2010 Resistive RAM: Technology and Market Opportunities
Deepak Sekar, NuPGA Corporation
IEEE SCV Electron Devices Society
Location: National Semiconductor
Abstract/bio
Speaker slides
Nov 16, 2010 Nanoelectronics: Innovation and Implementation
Half-day symposium by the Nanotechnology Council, co sponsored by EDS
Location: National Semiconductor
For available presentations
Oct 2010
Oct 12, 2010 Is it the End of the Road for Silicon in Power Management?
Dr. Alex Lidow, CEO Efficient Power Conversion Corporation
IEEE SCV EDS and PELS societies
Location: National Semiconductor,
Abstract/bio
Speaker slides
Oct 18, 2010 Intellectual Property (IP) Primer for Entrepreneurs and Early-Stage Companies
Jordan M. Becker, Partner, Perkins Coie
IEEE SCV CAS and EDS societies
Location:QualComm Santa Clara, Building B
Abstract/bio
Speaker slides
Oct 28, 2010 Second Annual IEEE-SCV Soft Error Rate (SER) Workshop 
Chiate Lin, Intersil; Prof. Bharat Bhuva, Vanderbilt U.; Rick Wong, Cisco Systems;Dr Andy Mackie, Indium Corp.; Charles Slayman, Ops a la Carte; Dr. Brett Clark, Honeywell; Dr. Nelson Tam, Marvell 
IEEE SCV CPMT/EDS/Rel societies
Location: Cisco or webinar
CPMT web page – slides etc.
Sept 2010
Sept 14, 2010 LDMOS – Technology and Applications
Shekar Mallikarjunaswamy, Alpha Omega Semiconductor 
IEEE SCV EDS seminar
Location: National Semiconductor 2900 Semiconductor Drive , Santa Clara , CA 95052
Abstract/bio
Speaker slides
Sept 28, 2010 The Makers of the Microchip: Creating the Planar Integrated Circuit, Establishing Silicon Valley
David Brock, Research Fellow, Chemical Heritage Foundation
Christophe Lecuyer, Principal Economic Analyst, UC
Co-sponsored with IEEE SSC+CS
Location: National Semiconductor
Abstract/Bio/Registration
Aug 2010
Aug 10, 2010 3-D ICs: Motivation, Performance Analysis, Technology and Applications
Dr. Krishna Saraswat, IEEE Fellow, Dept. of Electrical Engineering, Stanford University
IEEE SCV EDS and CPMT societies
Location: National Semiconductor, Building E-1, Conference Center
Abstract/bio
Speaker slides
July 2010
July 13, 2010 The Foundation of Today’s Digital World: The Triumph of the MOS Transistor
Ross Bassett, Lewis M. Terman, Les Vadasz, David A. Hodges
IEEE and CHM
Location: Computer History Museum.
Registration and further info
Jun 2010
Jun 7, 2010 New Driving Force for Electromigration in ULSI Interconnections and its implication to IC layout
Dr. Cher Ming Tan – School of EEE, Nanyang Technological University, Singapore
IEEE SCV EDS seminar
Location: National Semiconductor
Abstract/bio
Speaker slides
Jun 18, 2010 Nanoscale Manipulation of Conductive Filaments in Solid-Electrolyte-Based-ReRAM
Prof. Ming Liu, Institute of Microelectronics, Chinese Academy of Science (IMECAS), China.
IEEE SCV EDS seminar
Location: Santa Clara University
500 El Camino Real, Santa Clara, CA 95053
Abstract/bio
Speaker slides
May 2010
May 20, 2010 Trends in Solar Cell Technology
Dr. Betty Prince (New Energy Strategies International)
IEEE SCV Solid-State Circuits (SSC) and Electron Devices Societies (EDS)
Location: National Semiconductor
IEEE SSC event page
May 11, 2010 Thoughts on Directions for Silicon Technology Development as We Approach the End of CMOS Scaling
Tak H. Ning, IBM and IEEE Fellow, and co-author of the Taur & Ning textbook
IEEE SCV EDS seminar
Location: National Semiconductor
2900 Semiconductor Drive , Santa Clara , CA 95052
Abstract/bio
Speaker Slides
Apr 2010
Apr 13, 2010 The Semiconductor Industry’s Nanoelectronics Research Initiative (NRI): Motivation and Overview
Jeff Welser, IBM/Executive Director of NRI
IEEE SCV EDS seminar
Location: National Semiconductor, Building E-1, Conference Center
Abstract/bio
Speaker Slides
Mar 2010
Mar 16, 2010 2009 International Technology Roadmap for Semiconductors (ITRS) Update – Overview and Highlights
Alan K. Allan – SEMATECH 
IEEE SCV EDS seminar
Location: National Semiconductor, Building E-1, Conference Center
Abstract/bio
Speaker slidesPhoto below with one of the first fifty 450 mm wafers ever (wafer made by Nippon Mining & Metals).
Feb 2010
Feb 16, 2010 High Frequency Characterization of Transistors
J. Prasad, SuVolta Inc, Los Gatos, CA
IEEE SCV EDS seminar
Location: National Semiconductor, Building E-1, Conference Center
Abstract/bio
Click here for slides
Jan 2010
Jan 29, 2010 3D Interconnect – Shaping Future Technology
Full-day symposium with many exciting talks
Location: Hyatt Regency, 5101 Great America Pkwy, Santa Clara , CA 95054
Symposium: 9 AM – 5 PM
Reception/Poster session: 5 – 6:30 PM
Cost: Free. Refreshments and Lunch provided
Click here for flyer 
Click here for Agenda 
Click here for Abstracts/bio.List of speakers: (slides available as posted)

  • Matt Nowak, Qualcomm. Taming Cost and Design Challenges for High DensityThrough Silicon Stacking (TSS). 
    Click here for slides
  • Xiaopeng Xu, Synopsys. Modeling Thermo-Mechanical Stress Impact on Performance and Reliability of 3D Integration Structures.
  • Sesh_Ramaswami, Applied Materials. Journey Toward Process Convergence in TSV Technology
  • Zvi Or-Bach, NuPGA. 3D FPGA – The Path to ASIC Density, Power, and Performance.
  • Deepak C. Sekar, SanDisk. A 3D-IC Technology with Integrated Microfluidic Cooling.
  • Arif Rahman, Xilinx, Inc. Technology Requirements and Standardization for 3-DSiP.
  • Tom Ritzdorf, Semitool. Advances in Copper Fill for 3D Interconnect Applications.
  • William Chen, ASE Group. 3D and More: A Renaissance in the Making.
  • Raj Pendse, STATS ChipPAC 3D Integration: The Evolution of Device Architecture, Packaging, and Manufacturing Infrastructure
  • C. Raman Kothandaraman, IBM Through Silicon Via (TSV) for 3D integration

 

 

For talks before Jan. 2010, please click here