3D Heterogeneous Microsystem Integration

IEEE SCV PACE: 3D Heterogeneous Microsystem Integration For Biomedical Applications: A Major Step Toward Fully Autonomous Lab-on-Chip

Speakers:  Dr. Amine Miled,

University of Laval, Quebec, Canada 

Time: 6:00 pm -8:00 pm Tuesday, November 5 2013


Texas Instruments Auditorium,

2900 Semiconductor Drive, Santa Clara – 95050

Register at Eventbrite



Lab-on-Chip (LoC) are in their way to become the new biomedical standard. This talk coversthe new development and extended use of LoC, to integrate new technologies in addition to new modeling techniques approaches. The objective is to design a LoC with new functions for a fully autonomous device.

In this seminar, a first prototype of a LoC with microelectronics and microfluidic modules, integrated communication system and embedded power supply unit in order to  separate micro and nanoparticles with in vitro validations in cerebrospinal fluid are presented. A micro particle separation was achieved through the monitoring of electrical field propagation, frequency, phase, and amplitude using different architectures of electrodes. Our objective is to propose new diagnostic tools for a better understanding of neurodegenerative diseases.

We also came up with an innovative approach to give a greater flexibility to the modeling of LoCs. This approach consists of modeling the behavior of particles based on the architectural design of the electrodes, the applied signals, and the biological properties of the medium. This modeling technique is based on a hybrid approach including a finite element modeling using ANSYS, and an algorithm implemented on Matlab. Then it was possible to calculate each particle’s 3D position in a micro channel based on the results provided by ANSYS, which is not possible based on experimental results.

Also, we built this system entirely with a 3D architecture using heterogeneous technologies including a microfluidic chip, a Bluetooth wireless unit, and an embedded power supply module. The whole microelectronic part of the LoC is designed with CMOS 0.18 um TSMC technology. The microfluidic architecture was fabricated with a new microfabrication process using femto laser and high accuracy dicing saw.



6:00pm – Networking (food and drinks will be provided)

6:30pm – Presentation

7:45pm – Question & Answer Session



Dr. Amine Miled,

Prof. Amine Miled received his Ph.D. degree from École Polytechnique de Montréal, in Québec, Canada, in 2013. In 2013, he joined the Electrical and Computer Engineering Department at Laval University in Quebec City, Canada, where he is assistant professor and member of the Radio communications and Signal Processing Laboratory.

Prof. Miled received excellence scholarship award from Tunisia Government in 2005. He received the doctoral fellowship awards and Post-Doctoral fellowships from both Natural Sciences and Engineering Research Council of Canada (NSERC) and Fonds de recherche du Québec – Nature et technologies of Quebec (FQRNT) in 2008 and 2013, respectively. He was also pre-approved for Visiting Fellowships in Canadian Government Laboratories Program and Industrial R&D Fellowships from NSERC in 2013. He received MEMSCAP Microsystems Design Award and honorable mention in Brian L. Barge Award for Excellence category in Canadian Microelectronics Corporation Texpo 2010 and 2012 respectively.

Prof. Miled was also the founder of the first IEEE-Student branch in Tunisia in 2005. He received several awards for membership development and outstanding achievements from IEEE-Montreal and IEEE-Polytechnique de Montréal. He is also the Chair of IEEE-Canada translation committee.

Prof. Miled Interests are mainly on microelectronics (Integrated Circuit Design), microfluidics, microfabrication and microsystem design for biomedical applications. He is focusing on the development of miniaturized Lab-on-Chip for neurotransmitter sensing and manipulation for neurodegenerative diseases. His research topics also cover other applications such as water and air quality monitoring. His research is multidisciplinary going from multiphysics modeling with FEM to Packaging of Hybrid technologies and advanced microfabrication for microfluidic and high throughput microelectrode array.

He published more than 30 journal and conference papers, application notes and patent during the last 5 years in the field of microsystem design and modeling.

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