!!! Tesla Factory Tour Raffle !!!

Thanks to the efforts of our committee member, Tom Zwingman, we may have the opportunity to get a Tesla Factory Tour!

Date is TBD – we need to generate a list of the people attending first. We will have 24 spots.

We will raffle off tickets (including waiting list) at our April 5th seminar. You must be a IEEE member and must be present to get on the list . We will need your name, IEEE membership number, title, company, and email address. Once we have a date and time from Tesla we’ll ask you to commit or de-commit to generate the final list. Register below for the April 5th seminar!


Machine-Learned Assessment and Prediction of Robust Solid State Storage System Reliability Physics

Reliability physics of the complex memory sub-system of modern, robust solid state storage devices (SSDs) under throughput acceleration stress can be analyzed leveraging Machine Learning – towards understanding their inherently designed fault-tolerance schemes that mitigate expected memory degradation mechanisms through their reliable warranty life as a system. Given the strength of multiple designed error-management schemes effectively countering multiple memory degradation mechanisms under stress, the developed empirical data based Machine Learning framework allows inferential and predictive assessments on reliable SSD design at system-level, in a quantitative and pro-active manner. Such Machine-Learned quantitative assessments on the system-level health of individual devices can be utilized towards assessing dynamic throughput stress impact on design, managing qualification reliability assessments and/or associated decision-making on the reliability of individual and populations of solid-state storage devices/systems. In this talk, the first published description of this research will be discussed, along with the context of independent research affirming the fundamental physics and related Machine Learning application on SSD device health.


Bio- Jay Sarkar
Jay Sarkar is a Technologist at Western Digital Corporation focused on solid-state storage (SSD) analytics research and development. His prior professional experience has included core physics and reliability research and development on SSD technology, on the first Phase Change Memory technology implementation at Intel and Numonyx (Intel spin-off, now Micron) at 90 nm and 45 nm lithography nodes; and a novel reflective, power-efficient MEMS-based display technology development at Qualcomm. He has authored/co-authored 16 peer-reviewed international conference and journal papers across diverse domains of system and device physics, analytics, reliability and process modeling of SSDs, Phase Change Memory, 3-D NAND Flash memory and lower-dimensional electron transport. He has issued or filed/pending patents on machine-learned solid-state storage analytics, Phase Change memory array programming for robustness and MEMS encapsulation design. He earned a PhD in Electrical and Computer Engineering from the University of Texas at Austin (awarded the Ben Streetman Prize for dissertation research), M.S. in Applied Physics from Rice University, Houston and B.S. in Physics from the Indian Institute of Technology, Kharagpur. He is a member of the IEEE and has served on the Technical Program Committee of the International Reliability Physics Symposium (IRPS).
Food sponsored by I.C.E. Labs, ISO 9001 & 17025 Reliability Test Lab, www.icenginc.com
Attendance to this seminar will count towards professional development hours for IEEE, ASQ. Please feel free to forward this message to your friends and colleagues.
Check-in and pizza at 6:15 – 6:45 PM.
Presentation at 6:45 – 7:45 PM.
Q&A at 7:45PM


Reliability for the 21st Century: Meeting Challenges of New Packaging Technologies and New Markets

complexity, feature sizes, physics of failure, damage metrics, packaging design, qualification, proposed methodologies …

Electronics components are constantly evolving, with new types of devices rapidly entering new markets. New technologies are significantly more complex than the technologies of the past, characterized by smaller features and heterogeneous integration. New markets, on the other hand, bring about new types of environments, new customer expectations and new usage models. Existing industry standards often do not provide sufficient guidance for qualification of new technologies. This requires packaging design and reliability practitioners to look beyond the existing reliability standards so that they make sure their components are designed correctly for the new field.
This talk discusses challenges with many standards-based approaches for definition of qualification requirements and proposes a methodology for overcoming those challenges. The proposed methodology leverages advanced tools of contemporary engineering to comprehend use conditions and failure physics. The special focus is on the essential role of the physics-based damage metrics in translating from use condition to test conditions and in design for reliability. Examples from the area of electronic packaging design and qualification published in the literature will be used to discuss the proposed methodology relative to the standards-based qualifications.

Bio– Dr. Milena Vujosevic

Dr. Milena Vujosevic is a senior technologist and manager with more then 20 years of experience in the semiconductor industry working in the areas of technology development, design, and reliability. She is a Senior Director for Advanced Packaging at TDK-InvenSense, which she joined early in 2018. She is responsible for MEMS sensors packaging technology and manufacturing covering multiple technologies: motion, pressure, ultrasonic sensors for mobile, automotive and drone applications. Before that she spent 13 years at Intel as a Principal Engineer and Sr. Manager working in Intel’s packaging and reliability organizations focusing on  pathfinding and development of advanced IC packaging. Prior to joining Intel she worked for Motorola in the area of MEMS sensors for automotive, medical and consumer electronics markets. Milena has published more then 60 papers, 3 book chapters and delivered multiple invited talks. She is a recipient of the 2011 ASME Woman Engineer of the Year award for significant achievements in the field of electronic and photonic packaging. Milena has a PhD in Mechanical Engineering.

Check in and food at 11:30AM – 12:00 PM.
Presentation from 12:00 PM to 1:00 PM.

Thursday, April 05, 2018

Machine-Learned Assessment and Prediction of Robust Solid State Storage System Reliability Physics

Sponsored by IEEE SCV Reliability Chapter
Time: 6:15 pm – 8:00 pm
Qualcomm, Inc. Building-B Cafeteria, 


Wednesday, April 25, 2018
Reliability for the 21st Century
Sponsored by EPS Chapter; Reliability Chapter; MEMS & Sensors Chapter
Time: 11:30 AM Registration (and sandwiches/drinks)
Presentation-only: 12:00 noon (come at 11:45)
Cost: $5 IEEE members, students, unemployed; $10 non-members