The Innovator’s DNA – Sustaining Innovation in a Disruptive World 🗓 🗺

meeting
National Instruments 4600 Patrick Henry Drive Santa Clara, CA 95054 Map

The Santa Clara Valley Chapter of TEMS in co-sponsorship with the IEEE Young Professionals (IEEE-SCV-YP) Affinity Group presents:

Speaker: Sarosh Patel, PE, MSME, MBAregister
Meeting Date: Thursday, March 1, 2018
Time: 6:00 pm Networking; 6:30 pm Management Forum/Guided Networking;
7:00 pm sandwich dinner; 7:30 pm Presentation
Earlybird: $12 IEEE members, $15 non-members; At the Door: $20
Location: National Instruments, 4600 Patrick Henry Drive, Santa Clara, CA 95054
Directions: click map at right
Reservations: tems1803.eventbrite.com
SUMMARY
Management Forum / Guided Networking: Bring your Management Challenge and arrive by 6:30PM to join this lively Management Forum. Following the informal networking we have our small group discussions, related to the topic of the dinner talk, or to another topic of interest to each small group.
Light Dinner: This month we’re continuing with our light dinner format — typically sandwiches, salad, drinks, and cookie or similar light dinner.

Presentation: The Innovator’s DNA – Sustaining Innovation in a Disruptive World

We live in a culture and society whose life blood is innovation. In order for innovation to be successful, it needs to be sustainable. The presentation will discuss the types of innovation, the innovator’s DNA and the economics of innovation and what makes innovation sustainable. It will also discuss the challenges of innovation, how one can win through innovation and what the future holds for innovation. The presentation will include numerous examples from industry and from the speaker’s personal experiences with innovation.

Speaker: Sarosh Patel, PE, MSME, MBA

Sarosh Patel has spent most of his over 30 year career in the innovation “business” where he has played a key personal role in innovation, innovation management, and as a catalyst for innovation. Most recently he was Director of New Product Development for Johnstech International, and has worked in engineering and management positions at Fairchild, Fujitsu, Teradyne, KLA-Tencor and Infineon. He has twenty nine US and international patents awarded, eight pending and thirteen invention disclosures. New Product Development has included computer products, semiconductor capital equipment, solar, imaging systems and intellectual property management. He has a Master’s degree in Mechanical Engineering from Stanford, an MBA from SUNY Buffalo and is a registered Professional Engineer in California. Chairman of the System Packaging Committee IMAPS and has chaired Semitherm sessions and IMAPS symposiums.