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January 2019

System Assembly using a Microchip Printer

January 24 @ 11:30 am - 1:00 pm PST

We aim to develop a system which could rapidly assemble small semiconductor chips (<1mm) into electronic systems.  The process uses chips initially in solution, and then sorts, transports, and orients chips with directed electrostatic assembly with open and closed loop control.  Assemblies are then transferred to final substrates with a stamp or continuous feed roll-based method, and then electrically interconnected.  The current laboratory systems have handled small chips (10um-500um) and demonstrated fine registration (<1um and <1°).  Ultimately, massively parallel automated…

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Consumer Electronics Society CES Download 2019

January 24 @ 6:30 pm - 8:30 pm PST

  2019 CES Download Joseph Wei - Venture Partner, Skychee Ventures: Startups, Wearables and IoT for Consumers Tom Coughlin - President Coughlin Associates: Storage Devices and Technologies Meeting Place NVIDIA Marco Polo, 2800 Scott Blvd., Santa Clara (See map photo below) Admission Fee: Open to all to attend  Non-IEEE members - $10IEEE members - $5IEEE CES and IEEE Student members - Free (Please register in advance due to NVIDIA security policy. If you cannot register in advance, you can still show up at the door, but seating…

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Lecture by Dr. Ratnesh Kumar “Vehicle Re-identification for Smart Cities: A New Baseline Using Triplet Embedding”

January 31 @ 6:00 pm - 8:00 pm PST

Co-sponsored by: Solid State Circuits Society (SSCS) Dr. Ratnesh Kumar, Deep Learning Architect, Nvidia Corporation, San Jose, CA Event Organized By: Circuits and Systems Society (CASS) of the IEEE Santa Clara Valley Section Co-sponsors: Solid-State Circuits Society(SSCS) PROGRAM: 6:00 - 6:30 PM Networking & Refreshments6:30 - 7:45 PM Talk7:45 - 8:00 PM Q&A/Adjourn Watch the lecture live on Zoom from your home and anywhere around the world! Register now and you will be sent details one day before the event. Abstract: With the proliferation…

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February 2019

Advanced Packaging: A Perspective on 2D and 3D Architectures

February 7 @ 11:30 am - February 8 @ 1:00 am PST

Heterogeneous Integration (HI) of disparate computing and communications functions is a key enabler of performance in micro-electronic systems.  HI is crucially enabled by advanced packaging since packages are an optimal HI platform.  This talk will address the role of advanced packaging in enabling HI and will focus primarily on the technology evolution of package interconnect densities.  It will show how 2D and 3Dpackaging has evolved to provide increased interconnect density and how the different technology solutions available today meet the…

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How to Save a Program or Project that is Failing and Make a Good One the Best It Can Be

February 7 @ 6:00 pm - 9:00 pm PST

TEMS SCV/SF/OEB Webpage ===> TEMS-SCV-Website EVENTBRITE REGISTRATION ===> Register-for-TEMS0219   New programs and projects are the lifeblood of our society. Excellent methods, attributes and styles have been developed to lead these efforts. Yet still, about 75% of them do not succeed first attempt. The speaker will present what he did to evaluate big programs in trouble and lead them to success. He will discuss the elements needed to accomplish this. He will share how most of these elements are derived…

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Situational Decision Making: Leadership in a VUCA world

February 7 @ 6:00 pm - 9:00 pm PST

TEMS SCV/SF/OEB Webpage ===> TEMS-SCV-Website EVENTBRITE REGISTRATION ===> Register-for-TEMS0219 How would you like a magic x-ray to shine on your work and tell you how to approach it? Have you ever taken brilliant, decisive action, and it was wholly, utterly wrong? Or been completely stumped about how to make progress in what you thought was a straightforward situation? Or worked on a project that took dramatically longer than planned? Used Six-Sigma, PRINCE2, Design Thinking, or Lean Startup when an Agile, Critical Chain, Waterfall,…

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Situational Decision Making: Leadership in a VUCA (Volatility, Uncertainty, Complexity & Ambiguity) world

February 7 @ 6:00 pm - 9:00 pm PST

TEMS SCV/SF/OEB Webpage ===> TEMS-SCV-Website EVENTBRITE REGISTRATION ===> Register-for-TEMS0219 How would you like a magic x-ray to shine on your work and tell you how to approach it? Have you ever taken brilliant, decisive action, and it was wholly, utterly wrong? Or been completely stumped about how to make progress in what you thought was a straightforward situation? Or worked on a project that took dramatically longer than planned? Used Six-Sigma, PRINCE2, Design Thinking, or Lean Startup when an Agile, Critical Chain, Waterfall,…

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Heterogeneous Integration Roadmap v1.0 – Annual Symposium

February 21 @ 8:30 am - February 22 @ 6:00 pm PST

Summary: Heterogeneous Integration will be the key technology direction going forward, for device and subsystem integration. It is the “low hanging fruit” for initiating a new era of technological and scientific advances to continue and complement the progression of Moore’s Law scaling into the distant future. Presentations from HIR Technical Working Group chairs.   Location: Bldg: SEMI International Headquarters 673 S Milpitas Blvd Milpitas, California 95035

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March 2019

Managing Frugal Innovation: the Challenges of Humanitarian Engineering

March 7 @ 6:00 pm - 9:00 pm PST

TEMS SCV/SF/OEB Webpage ===> TEMS-SCV-Website EVENTBRITE REGISTRATION ===> Register-for-TEMS0319 Frugal Innovation is a strong trend in humanitarian engineering, as it is based on the idea of using less resources. However, managing frugal innovation can be a challenge in impoverished areas. In this talk, we will discuss these challenges and present some ideas on how to overcome some of the problems. Speaker(s): Prof. Silvia Figueira PhD, Director of the Frugal Innovation Hub, Santa Clara University, Agenda:  6:00 PM: Registration & Informal…

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April 2019

Part 2: The 60 Minute Harvard MBA for Business Leaders and Entrepreneurs

April 4 @ 6:00 pm - 9:00 pm PDT

TEMS SCV/SF/OEB Webpage ===> TEMS-SCV-Website EVENTBRITE REGISTRATION ===> Register-for-TEMS0419 This is a continuation of a very popular talk we had on December 2017. Please join us for an encore/recap and more insights into business leadership.  Growing up in a fourth generation family business, I was always curious why some businesses prospered while others stagnated or even failed. I focused my studies at Harvard Business School on small to mid-size businesses, finding their smaller size and flatter organizations made it easier…

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September 2019

SCV Section Executive Committee Meeting (AMD)

September 4 @ 6:00 pm - 8:00 pm PST
|Recurring Event (See all)
An event every 1 month(s) on that lasts 0 day(s) and 2 hour(s), but only create 2017-06-30 event(s)
Advanced Micro Devices, AMD Campus,, 1 AMD PLACE
Sunnyvale, California 94088-3453 United States
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Santa Clara Valley Executive Committee Meeting    Advanced Micro Devices, AMD Campus,   Commons C-6/7/8 for ExCom Meeting through December   1 AMD PLACE, Sunnyvale, CA, 94088-3453   Call to Order at 6:00 PM - Adjourn at 8:00 PM

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