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November 2018

FPGA Heterogeneous Packaging Applications: Trends and Challenges

November 14 @ 11:30 am - 1:00 pm PST

Deep learning and artificial intelligence are at the heart of today’s technological innovations. Driven by advanced applications in HPC (High Performance Computing), Networking, Cloud Services and Automotive, demand for high bandwidth, lower latency and lower system power solutions have gained a lot of interest and momentum. As HPC designs move to several TB/sec and Telecom pushes to 400G/800G systems, bottlenecks in lower-latency memory bandwidth require HBM (High Bandwidth DRAM Memory) integration.Advanced heterogeneous packaging based on 2.5D CoWoS®/3D/Fan-out InFO or other…

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Edge Compute Data Centers

Co-sponsored by: Google Presentation: An Introduction to Edge Compute Data Centers.  The new electrical power load coming to a location near you! Self-driving cars, Smart Cities, Smart Agriculture, Smart Factories, Healthcare, Education, Industrial IoT, Video, and other applications are all driving a need for local enterprise grade IT.  This will reduce bandwidth, latency and drive processing local to the application.   This presentation will discuss how a new class of data center is emerging, “The Edge Data Center.”  It traces the…

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Role of Si-Based Technology for 5G Frontend

November 14 @ 6:00 pm - 8:00 pm PST

  '5G' is next generational step for the wireless industry after 4G and is envisioned as virtualized, software-defined, next-generation wireless networks that connect many more people, devices and things at even greater speeds and quality of connection, over much wider areas. Currently 5G trials are being implemented in sub-6GHz and in near future will likely operate at 28 GHz (United States) and 39 GHz (Europe). Over time, 5G could involve other spectrum, such as 50GHz, 60GHz, 71-86 GHz and a…

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2018 IEEE SCV Instrumentation and Measurement Technical Seminar

November 14 @ 6:30 pm - 8:15 pm PST

Co-sponsored by: IEEE SCV Communication Society A technial talk on "Seeing Hidden Objects in Layered Media using Synthetic Aperture Radar Technology" will be given by Dr. Mojtaba Fallahpour. This seminar is organized by the IEEE Santa Clara Valley Section Instrumentation and Measurement Chapter. IEEE members and non-members are invited. Admission is free. RSVP to brian.lee@ieee.org is required.   Speaker(s): Mojtaba Fallahpour, Agenda: 6:30 PM to 6:45 PM Check in and Refreshment 6:45 PM to 7:45 PM Presentation 7:45 PM to…

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December 2018

Improving the IEEE: Issues, Ideas, Best Practices

This will be a “listening event” for engineers and managers in Silicon Valley who have ideas for improving the IEEE, or have issues with how IEEE is run. If you wish to bring specific thoughts about IEEE improvements, be prepared to present them to the group for, say, 5 minutes, for discussion and enhancement.  With input and grass-roots suggestions for improving the IEEE, I intend to provide actionable feedback at the IEEE TAB and BOD level. Our input will be…

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IEEE CE Society: Drones Sensor Technologies and Issues

December 4 @ 6:30 pm - 8:30 pm PST

Co-sponsored by: ComSoc SCV and SPS SCV What do Uber, Airbus, Larry Page, Amazon, Chipotle’s, UPS and Domino’s all have in common? They are planning on air taxis, flying cars, flying burritos, and drone deliveries landing and taking off at a place near you in the next few years … and they are committing hundreds of millions of dollars to make it happen!  A shortage of pilots and a desire to create more revenue generation opportunities means most of these…

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Meet by Design: Using Science to Run Awesome Meetings

December 6 @ 6:00 pm - 9:00 pm PST

TEMS SCV/SF/OEB Webpage ===> TEMS-SCV-Website EVENTBRITE REGISTRATION ===> Register-for-TEMS1218 Keep meetings short, always use an agenda, stand up, take notes on paper – and hop on one leg while you’re at it! There’s no shortage of advice about meetings out there, but what really matters? In this interactive talk, you’ll learn: THE SCIENCE OF ENGAGING TEAM MEETINGSWhat the research shows about team engagement in meetings and how this impacts your team’s overall performance. THE TAXONOMY OF BUSINESS MEETINGSThe 16 different…

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Lecture by Dr. Hans Klein: “Advanced Capacitive Sensing for Consumer, Industrial, and Automotive Applications”

December 6 @ 6:00 pm - 8:00 pm PST

Co-sponsored by: Solid State Circuits Society (SSCS) DESCRIPTION: "Advanced Capacitive Sensing for Consumer, Industrial, and Automotive Applications" Dr. Hans Klein, Analog CTO, Cypress Semiconductor Corp., San Jose Event Organized By: Circuits and Systems Society (CASS) of the IEEE Santa Clara Valley Section Co-sponsors: Solid-State Circuits Society(SSCS) PROGRAM: 6:00 - 6:30 PM Networking & Refreshments6:30 - 7:45 PM Talk7:45 - 8:00 PM Q&A/Adjourn Watch the lecture live on Zoom from your home and anywhere around the world! Register now and you will be sent details…

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February 2019

How to Save a Program or Project that is Failing and Make a Good One the Best It Can Be

February 7, 2019 @ 6:00 pm - 9:00 pm PST

TEMS SCV/SF/OEB Webpage ===> TEMS-SCV-Website EVENTBRITE REGISTRATION ===> Register-for-TEMS0219   New programs and projects are the lifeblood of our society. Excellent methods, attributes and styles have been developed to lead these efforts. Yet still, about 75% of them do not succeed first attempt. The speaker will present what he did to evaluate big programs in trouble and lead them to success. He will discuss the elements needed to accomplish this. He will share how most of these elements are derived…

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September 2019

SCV Section Executive Committee Meeting (AMD)

September 4, 2019 @ 6:00 pm - 8:00 pm PST
|Recurring Event (See all)
An event every 1 month(s) on that lasts 0 day(s) and 2 hour(s), but only create 2017-06-30 event(s)
Advanced Micro Devices, AMD Campus,, 1 AMD PLACE
Sunnyvale, California 94088-3453 United States
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Santa Clara Valley Executive Committee Meeting    Advanced Micro Devices, AMD Campus,   Commons C-6/7/8 for ExCom Meeting through December   1 AMD PLACE, Sunnyvale, CA, 94088-3453   Call to Order at 6:00 PM - Adjourn at 8:00 PM

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