October 16, 2012 Noon-1PM
TI Auditorium E-1
2900 Semiconductor Drive. Santa Clara, CA
TITLE: Novel Thermal Interface Materials for 3D Chip Stacks
SPEAKER: Srilakshmi Lingamneni,
Ph.D Candidate, Stanford Nanoheat Laboratory, Stanford University
This talk will present an overview of the broad spectrum of research work being carried out at ‘Stanford Nanoheat Laboratory’, the state of the art thermal characterization tools at our lab and the novel mechanical characterization tools that are being developed. It will discuss in detail the past work, latest developments and future directions of research in nanostructured interface materials. The talk will then explore the thermal challenges of 3D IC integration and new material requirements for thermal management in 3D packaging and discuss the novel interface materials that are being developed.
Srilakshmi Lingamneni received her B.Tech in Mechanical Engineering from Indian Institute of Technology, Madras in 2008 and M.S. in Mechanical Engineering from Stanford University in 2010. She is currently pursuing Ph.D. in Mechanical Engineering at Stanford University. She was a Stanford Mechanical Engineering department teaching assistant for the academic years, 2008-2010. Her research interests include development of various thermal interface materials for thermal management in electronics, with a particular focus on materials for 3D integrated chips.
AGENDA: Registration & light lunch 11:30am. Presentation & Q/A 12:00 to 1pm