Tuesday September 17, 2013
Noon – 1 pm
Texas Instruments (TI) Auditorium E-1
2900 Semiconductor Drive
Santa Clara, CA
TITLE: Thermal Management At The Extremes
SPEAKER: Ken Goodson, Professor & Department Chair, Stanford University, Mechanical Engineering
The semiconductor industry is pushing many technological boundaries, and this motivates thermal management research at extreme lengthscales, timescales, and power densities. At Stanford we are grappling with several related questions: Are there thermal scaling limits for nanotransistors below 10 nm? What exotic cooling methods are needed for highly integrated 3D chips and power electronics? Can we convert waste heat to electrical power for appliances, sensor arrays, and efficient vehicles?
This talk covers these challenges and describes the rapidly evolving thermal management toolset from picosecond lasers and submicron infrared imaging to Monte Carlo simulations that is helping to sort them out. The talk also highlights the enormous help we receive from semiconductor companies, in particular here in Silicon Valley.
Ken Goodson is Professor and Department Chair of Mechanical Engineering at Stanford. His lab (nanoheat.stanford.edu) has graduated 40 PhDs including twelve professors from MIT and Stanford to UC Berkeley and numerous engineering staff at high-tech companies. Goodson studied at MIT (BS89, PhD93) and has co-authored 32 US patents, 170 archival journal articles, and 210 conference papers. Goodson is a Fellow with ASME and IEEE. Recognition includes the ASME Kraus Medal, the 2013 THERMI Award, plenary lectures at INTERPACK, ITHERM, PHONONS, SEMITHERM, and THERMINIC, and best/outstanding paper awards at SEMITHERM, ITHERM, and the IEDM. Goodson co-founded Cooligy, which built microfluidic cooling systems for computers (including the Apple G5) and was acquired by Emerson in 2006.
- 11:30 am – Registration & light lunch (pizza & drinks)
- Noon – Presentation & Questions/Answers
- 1:00 pm – Adjourn