Research Progress of Electromigration (EM) and Thermomigration (TM) in Solder Interconnects
Abstract
Mass redistribution due to electromigration (EM) and thermomigration (TM) has been known to cause phase separation, voids and hillocks formation, whisker growth and others in solder interconnects. The “interconnects” reliability is challenged by the potential open and short failures as well as degradation of mechanical strength. This reliability issue is becoming more acute due to the trend towards decreased joint size and increased current load per joint. This presentation summarizes the current research progress, in EPA Centre of City University of Hong Kong, on the failure mechanisms in solder interconnects, including possible mitigation solutions for improving the reliability, such as nanoparticles doping in solder or under bump metallization (UBM) layers, or multi-layered UBM.
About The Speakers
Professor Y.C. CHAN obtained his PhD in 1983, MSc (Eng) in 1978 and BSc (Eng) in 1977 from Imperial College of Science and Technology, London, and is currently Chair Professor of Electronic Engineering and Director of the Centre for Electronic Packaging, Failure Analysis and Reliability Engineering (EPA Centre) at City University of Hong Kong, http://www.ee.cityu.edu.hk/~epa/. Previously, he had a distinguished career in industry, including posts at Fairchild Semiconductor (CA, USA), SAE Magnetics (HK) and Seagate Technology (Singapore). He was elected Fellow of the IET in 2002, and Fellow of the Institute of Electrical and Electronic Engineers in 2004. Prof. Chan has authored over 270 journal publications, 128 International conference papers and 4 books. His work is heavily cited (Most Cited Researcher in 2016 : Subject – Electrical & Electronic Engineering according to Shanghai Ranking’s Global Ranking of Academic Subjects 2016 – the official website of The Academic Ranking of World Universities,), and Scopus citations: 6209 & h-index 42, Web of Science citations: 5176 & h-index 39, Google scholar citations: 7793 & index 47), with his invited review “Failure mechanisms of solder interconnect under current stressing in advanced electronic packages”, Prog. Mat Sci 55, 428-475 (2010) attracting particular interest. He has graduated 22 PhDs and 9 MPhils in Electronic Packaging and Reliability Engineering, and many of his former students are successful entrepreneurs, senior industrial managers or full professors.
Mr. Ze ZHU received his B. Eng. degree in Electronics Packaging Technology from Huazhong University of Science and Technology, Wuhan, China, in 2014. He is working towards the Ph. D. degree in Electronic Engineering at City University of Hong Kong. His research interests include electronic packaging materials and technologies, reliability of electronic interconnection and failure analysis.