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May 2019

SiC device manufacturing using ion implantation: Opportunities and challenges

May 23 @ 15:00 - 16:00
KTH Electrum Kista, Room Grove, Elevator C floor 4, Electrum
Kista, Sweden

  Dr. Tobias Erlbacher Fraunhofer Institute of Integrated Systems and Device Technology IISB, Erlangen, Germany Abstract Manufacturing of vertical power transistors utilizes doping by ion implantation. However, in contrast to silicon, SiC manufacturing technology is still maturing. This presentation will highlight the challenges of doping SiC by ion implantation: Besides activation at higher temperatures than in silicon, channeling of ions occurs to a higher degree in SiC. Moreover, fabrication of implanted regions with aluminum is hampered by defects which constitute compensation…

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Power semiconductor devices in the modern era of electrification

May 29 @ 10:00 - 11:00
KTH Electrum Kista, Room Darlington, Elevator B floor 4, Kistagången 16
Kista, Sweden

Prof. Florin Udrea Cambridge University, UK Abstract The power devices field has seen tremendous changes in the last decade. The traditional power MOSFET has been largely replaced by a new class of power devices based on the Silicon Superjunction concept, while the Insulated Gate Bipolar Transistors (IGBTs) are now fabricated on 12 inch wafers and have access to the latest thin wafer/trench/fine dimension technologies. However most of the innovation and flavor in the field comes from the emergence of Wide…

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June 2019

4th IEEE European Symposium on Security and Privacy

June 17 - June 19
KTH Royal Institute of Technology Stockholm, Sweden + Google Map

Since 1980, the IEEE Symposium on Security and Privacy has been the premier forum for presenting developments in computer security and electronic privacy, and for bringing together researchers and practitioners in the field. Following this story of success, IEEE initiated the European Symposium on Security and Privacy (EuroS&P), which is organized every year in a European city. The 4th EuroS&P edition will be held on June 17-19, 2019 in Stockholm, at the KTH main campus

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July 2019

12th International Symposium on High-Level Parallel Programming and Applications (HLPP-2019)

July 3 - July 5

Aims and scope of HLPP:   As processor and system manufacturers increase the amount of both inter- and intra-chip parallelism it becomes crucial to provide the software industry with high-level, clean and efficient tools for parallel programming. Parallel and distributed programming methodologies are currently dominated by low-level techniques such as send/receive message passing, or equivalently unstructured shared memory mechanisms. Higher-level, structured approaches offer many possible advantages and have a key role to play in the scalable exploitation of ubiquitous parallelism.…

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