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The Nordic Conference on Microelectronics Packaging, NordPac 2018

June 12 - June 14

12th – 14th June 2018 at VTT in Oulu, Finland

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We are proud to announce that the 2018 NordPac conference will be held in Finland. The event brand NordPac was introduced in Gothenburg in 2017 as a collaboration between IMAPS Nordic and IEEE EPS Nordic. The conference will take place at VTT Technical Research Centre of Finland Ltd in Oulu. The IMAPS Nordic conference was here in 2014.

You are welcome to submit an abstract and suggestion for a paper to the NordPac Conference 2018. The abstract must be non-commercial and submitted in electronic form

to abstract@nordpac.org no later than March 20, 2018. Speakers will be notified of paper acceptance by email by April 20.

For students we have the possibility to have papers classified as Reviewed and published in both IEEE Xplore and IMAPS North America IMAPSource, see http://ieeexplore.ieee.org/ and http://www.imapsource.org.

The deadline for the final paper is May 22, but if you want your paper to be reviewed deadline is May 1st. Late papers are not published.

As part of the annual IMAPS Nordic conference, PhD and Master Students are especially encouraged to submit an abstract. For this we have set up a Review process for those who need reviewed and published papers. This is a great opportunity to interact with the industrial and academic community at an international level (coming from inside and outside the Nordic countries).


June 12
June 14