Test Technology Technical Council India Chapter

Test Technology Technical Council India Chapter

IEEE

Archive for 2013

TTTC India Chapter Broadcast Mail – Call for Papers – VLSI Design Conference 2014

Monday, July 8th, 2013
Dear Distinguished Colleague,

It is a pleasure to invite you to submit your Original Research Paper in
“27th International Conference on VLSI Design and also in the
Concurrently run 13th International Conference on Embedded Systems” to be
held in Indian Institute of Technology Bombay, Mumbai, India from 5th
January to 9th January 2014. The Conference is sponsored by VLSI Society
of India and Technically sponsored by IEEE. The Conference proceeding will
be published in soft form only. All accepted papers will be
accessible through IEEE Explore system. The topics of Conference’s
interest are all aspects of VLSI Design and Embedded systems.

Authors are invited to submit original abstracts and papers through paper
submission system: https://www.easychair.org/account/signin.cgi?conf=demo
after registering for an “easychair” account as per dates given below. The
conference website is at: http://vlsidesignconference.org/. The areas in
which papers could be submitted are:

1. Embedded Systems

Embedded system hardware/software co-design; Reconfigurable hardware
design; Embedded software; Real-time operating systems; Middleware and
virtualization; Embedded multi-cores and many-cores; Communications;
Encryption, security, compression; Hybrid systems-on-chip; Sensor
networks; Programmable devices; Hardware-software co-verification;
Embedded system reliability; Embedded applications (automotive, mobile,
medical, etc.), platforms, and case studies

2.  Digital Design
Low-power design; Asynchronous design; Package and board design

3. Analog/RF Design
Low-power design; Analog, mixed-signal,  and RF systems; Package and board
design

4. System-level Design/ESL
System-level design methodology; Gigascale design methodology; Multicore
systems; Processor and memory design; Concurrent interconnect;
Networks-on-chip; Defect tolerant architectures

5. Logic Synthesis and Physical Design
Logic synthesis; Technology mapping; Asynchronous synthesis; Physical
design; Floor planning; Placement; Routing; Clock Design; Layout issues in
design for manufacturability

6. Test and Reliability
Fault modeling/simulation; ATPG; DFT; Delay test; Fault-tolerance; Online
test; AMS/RF test; Board-level and system-level test; Silicon debug,
post-silicon validation; Memory test; Reliability test

7. Functional Verification
Behavioral Simulation; RTL Simulation; Coverage Driven Verification;
Assertion Based Verification; Gate-level simulation; Emulation; Hardware
Assisted Verification; Formal Verification; Equivalence Checking;
Verification Methodologies

8.Device/circuit simulation and modeling
Design verification; Signal integrity; Technology
modeling-design-simulation; Analog/mixed-signal simulation; Multi-domain
simulation; Numerical methods; Device modeling; Timing analysis;
Asynchronous timing; Device/circuit level variability models; Reliability
simulation

9.Emerging Technologies
Issues in nano-CMOS technologies; MEMS; CMOS sensors; CAD/EDA
methodologies for nanotechnology; Non-classical CMOS; Post-CMOS devices;
Biomedical circuits and systems

Kindly see below the “Important Dates”:

Due Date for Abstract Submission: July 24, 2013
Due Date for Full Paper Submission: July 31, 2013
Due date of Acceptance Notification: September 17, 2013
Due date for Camera ready paper : October 10, 2013

Please note once again the Conference Date which is: January 5-9, 2014.
For additional details you may go through the attached flyer please.

We wish to welcome all of you to IIT Bombay, Mumbai,India for this
conference.

A.N.Chandorkar
General Chair, VLSI Design -2014
Institute Chair Professor and Emeritus Fellow
EE Department, IIT Bombay, Powai, Mumbai- 400076, India


Secretariat,
VLSI Design & Embededed Systems Conference 2014
IIT Bombay, Powai, Mumbai – 400076
India.

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Download (PDF, 144KB)

 

TTTC India Chapter Kicked-off

Friday, June 21st, 2013

The kick-off meeting of TTTC India Chapter was held on June 14th. It was half day event and hosted in Synopsys’s Bangalore office.

There were 18 organizations from Semiconductor design and EDA that participated in the event. These are AMD, ARM, Cadence, Cypress, Intel, Mentor, Nvidia, NXP, Open Silicon, Oracle, PMC Sierra, Qualcomm, Smartplay, ST, Sykatiya, Synopsys, Tessolve, TI. ST representative came from Noida to attend the event.

Dr Rohit Kapur, IEEE Fellow and Synopsys Scientist, represented TTTC. He is the 2nd Vice-Chair of TTTC and was visiting India. It was also attended by a representative of IEEE Bangalore Section’s execom.tttc_India_kick_off